Imec has an excellent track record of providing industry-relevant solutions for next-generation logic and memory devices. Our R&D offering is supported by our world-famous expertise in characterization, metrology, design, modeling, reliability analysis, system-technology co-optimization and more.
From exploratory research to development and/or production, we deliver product-relevant funneling and concrete solutions through a unique and valuable ecosystem of industry, suppliers and academic players.
Industry’s largest partner ecosystem
Imec brings together all key players from all layers of the value chain of the semiconductor industry, from tool & material suppliers to IDMs & foundries and fabless & fablite companies all the way up to the application partners.
More than ever, equipment & material suppliers are playing a key role in collectively tackling the scaling challenges posed by today’s fast-evolving, equipment-intensive, consolidating semiconductor landscape. Strong R&D interactions between manufacturers and suppliers at an early stage of development help to accelerate technology advancements, enabling efficient cost sharing, minimizing risk, and optimizing the return on investment for IDMs & foundries as well as equipment suppliers.
Industry’s most advanced R&D 300mm cleanroom facility
Imec offers a neutral, open innovation R&D platform that involves suppliers more deeply and at an early stage of process step and module development. Thanks to our close partnerships with leading tool and materials suppliers, we can do advanced process development and offer our partners the industry’s most advanced research infrastructure housed within a state-of-the-art 300mm cleanroom.
Our advanced semiconductor technology and processing R&D covers diverse topics including:
Next-generation logic devices
Explore why imec’s research and R&D into logic device scaling makes it the ideal partner in realizing advanced logic devices projects.
Novel memory concepts
Find out more about imec’s world-leading research into low-temperature and powerful storage solutions for next-generation devices.
Advanced patterning and key process steps
Learn more about imec’s best-in-class infrastructure for the development of front and back end-of-line processes and patterning technologies.
3D system integration
Learn more about imec’s pioneering R&D activities concerning advanced 3D interconnect technology.
Discover more about imec’s R&D and industrial affiliation program addressing advanced interconnects.
Explore imec’s expertise and R&D activities in neuromorphic computing aiming to surpass the possibilities of silicon CMOS.
Learn more about imec’s advanced research into quantum computing, supercomputing and scaling CMOS beyond 5nm technology.
How can we help you?
At imec bright people build a bright future.
You could be one of these builders. Whether you are an engineer or an operator, a consultant or PhD student, we need a versatile group of people to help us create positive change.Join the forward thinkers
PhD researcher on Advanced monolithic III-V on Si photodetectors for next-generation optical interconnects
PhD researcher on Single device analysis with atom probe tomography and electrical SPM
PhD researcher on Hot-carrier degradation in 3D vertical CMOS VLSI technologies
PhD researcher on Impact of emerging non-volatile memory design on system architecturesMore job opportunities
What can we do for you?
- Our industrial affiliation program connects you to our global partner ecosystem and gives you access to shared research results.
- Our industrial affiliation programs enable you to share costs and lower the risk of precompetitive research through collaboration.
- Our research teams closely collaborate with yours to accelerate your product roadmap and shorten your time-to-market.
Why work with us?
- Our unique, state-of-the-art 300mm infrastructure is the most advanced research facility in the world.
- Our in-depth technology knowledge is supported by our impressive expertise centers in material and component analysis, modeling, metrology, reliability, process steps, system-technology co-optimization, and more.