ATTO

Project title

A new concept for ultra-high capacity wireless networks

Funding mechanism

H2020, ERC Advanced Grant Piet Demeester

Timing

01 January 2017 – 31 December 2021

Description

In a number of domains such as manufacturing, robots have become indispensable. The next step is to integrate intelligent robotics in all areas of our daily lives. The project aims to prepare for this future by applying close-proximity wireless communications using low interference ultra-small cells (‘ATTO-cells’) integrated in floors and connected to antennas on the floor-facing surface of ground moving objects. That way each individual object would have a dedicated ultra-high-speed mobile connection in combination with extremely low mobile signal delays. The project will lay the foundation for a range of mobile applications, but will also support the use of highly-demanding wireless services in robot factories, intelligent hospitals and flexible offices.

Further information

Video: https://www.youtube.com/watch?v=hfc4w8GAIzU

Imec magazine: https://www.imec-int.com/en/imec-magazine/imec-magazine-april-2017/60ghz-technology-for-wigig-and-5g-applications

 

PRIME

Project title

Ultra-low power technologies and memory architectures for IoT

Funding mechanism

H2020, ECSEL JU

Timing

01 December 2015 – 31 March 2019

Description

PRIME will develop and demonstrate the key building blocks of Ultra Low Power (ULP) systems for Internet of Things (IoT) applications in medical, agricultural, domestics and security domains. The European industry strongly invests in the IoT revolution and has already built up a competitive economical position. By establishing an open ULP technology platform, PRIME could strengthen the leading European eco-system.

Further information

Video ECSEL, electronics in Europe: https://vimeo.com/233313776

EU project webpage: http://cordis.europa.eu/project/rcn/203402_en.html

IoSense

Project title

Flexible FE/BE sensor pilot line for the Internet of Everything

Funding mechanism

H2020, ECSEL JU

Timing

01 May 2016 – 31 April 2019

Description

The European Electronics Components and Systems (ECS) industries are already involved in the development of sensor systems for Internet of Things (IoT) applications. However, there is a significant time gap between these innovative ideas and high-volume production. IoSense aims to increase the pilot production capacity and improve the Time-to-Market for IoT microelectronics by establishing three fully connected semiconductor pilot lines in Europe. The new pilot lines will be integrated into the existing specialized R&D and manufacturing lines, and will target solutions for grand societal challenges related to Smart Mobility, Society, Energy, Health and Production.

Further information

Video ECSEL, electronics in Europe: https://vimeo.com/233313776

Website: http://www.iosense.eu/

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