SEMI 3D systems summit

January 27-29, 2020 / Dresden, DE

From 3D technologies to Heterogeneous Integration and High-Density Systems for different applications.

Imec at 3D & systems summit

We will be present at booth 14, visit us to learn more about our 3D offering.

Talk by Eric Beyne, VP R&D, Program Director 3D System Integration, imec, 28 January at 4:00 pm - 4:25 pm
High Performance 3D System Partitioning and Backside Power Delivery: Progress in EDA and 3D Integration Technology


The 3D & Systems Summit will address the most relevant and controversial topics related to 3D integration and system in packaging manufacturing as well as applications. After six successful editions of the European 3D Summit, SEMI Europe invites you to join the 1st Edition of 3D & Systems Summit taking place in January 2019 in Dresden, Germany. The event will offer a brand new agenda, invited high-caliber speakers, exhibition area and unique networking opportunities to all participants and exhibitors. 

2019 main topics & highlights

  • 3DIC Through-Silicon-Via (TSV) technology

  • 2.5D, 3D FO-WLP/e-WLB

  • Active and passive interposers

  • Stacked dies or stacked wafers

  • 3D alternative technologies

  • 5G Integration

  • Invited speakers and Keynotes

  • Exhibition area

  • Networking opportunities

Discover more

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