SEMI 3D systems summit

January 27-29, 2020 / Dresden, DE

From 3D technologies to Heterogeneous Integration and High-Density Systems for different applications.

The 3D & Systems Summit will address the most relevant and controversial topics related to 3D integration and system in packaging manufacturing as well as applications. After six successful editions of the European 3D Summit, SEMI Europe invites you to join the 1st Edition of 3D & Systems Summit taking place in January 2019 in Dresden, Germany. The event will offer a brand new agenda, invited high-caliber speakers, exhibition area and unique networking opportunities to all participants and exhibitors. 

2019 main topics & highlights

  • 3DIC Through-Silicon-Via (TSV) technology

  • 2.5D, 3D FO-WLP/e-WLB

  • Active and passive interposers

  • Stacked dies or stacked wafers

  • 3D alternative technologies

  • 5G Integration

  • Invited speakers and Keynotes

  • Exhibition area

  • Networking opportunities

Discover more

This website uses cookies for analytics purposes only without any commercial intent. Find out more here. Our privacy statement can be found here. Some content (videos, iframes, forms,...) on this website will only appear when you have accepted the cookies.

Accept cookies