20 - 22 May 2024 | Osaka, Japan
WCAM, initiated from 2012, with system conference - World Congress of Smart Materials(WCSM), has been successfully organized in Beijing, Japan, Xi'an, Tokyo, Rome, Busan, Chongqing, Bangkok, Suzhou and Xiamen. More than 6,000 participants have been attracted from over 50 countries and regions in the previous 9 years. They continue to expand with magnificent scientific and social programs to maximize your network in a free communication meeting environment.
Talk on Towards submicron polymer based RDL: Strategies for Advanced Packaging by Nelson Pinho
WCAM, initiated from 2012, with system conference - World Congress of Smart Materials(WCSM), has been successfully organized in Beijing, Japan, Xi'an, Tokyo, Rome, Busan, Chongqing, Bangkok, Suzhou and Xiamen. More than 6,000 participants have been attracted from over 50 countries and regions in the previous 9 years. They continue to expand with magnificent scientific and social programs to maximize your network in a free communication meeting environment.