Our cutting-edge optical devices are processed at wafer scale in our in-house 200mm and 300mm CMOS pilot lines. They include high performance devices for light modulation, switching, coupling, filtering and detection at data rates of 50GB/s and beyond.
Use qualified reference components from our device library or explore your own custom silicon photonic designs implemented in our platform. Multi-Project Wafer (MPW) runs enable you to cost-efficiently manufacture silicon photonics devices with cutting-edge performance.
Our state-of-the-art silicon photonics R&D portfolio covers:
Silicon photonic ICs for prototyping
Discover imec’s versatile high-performance silicon photonics platform, iSiPP, which enables competitive ICs for short reach optical interconnects.
Next-generation silicon photonics
Discover imec’s research into fully CMOS-compatible silicon-based optical links for datacom network, backplane, board, interposer and chip-level interconnects.
Terahertz sensing and imaging
The intrinsic properties of terahertz (THz) technology result in a wide scope of potential sensing and imaging applications.
How can we help you?
Some examples of what we have done
H2020 MORPHIC project
In the H2020 MORPHIC project we develop a new class of programmable optical chips enabled by a combination of MEMS technology and Silicon Photonics. These chips can dramatically shorten the prototyping and deployment cycle of new photonic applications. More info on: https://h2020morphic.eu/
At imec bright people build a bright future.
You could be one of these builders. Whether you are an engineer or an operator, a consultant or PhD student, we need a versatile group of people to help us create positive change.Join the forward thinkers
Team Leader, Assembly Integration
Join the 3D team at imec’s R&D headquarters located in the heart of Europe and help in revolutionizing Advanced Packaging technology!
Process Engineer Bonding & Assembly
First line troubleshooting for all tools and processes in the Wafer Bonding & Assembly area.
Group Leader Thin Film Deposition Process Engineering
As an inspirational Group Leader for Thin Films Deposition (TFE), with a strong technical background in the area of PVD, CVD, ALD, Epitaxy and Furnace techniques, you are responsible for the day-to-day support to the Fab in these techniques.
Non-reciprocal optical components are key for new generation optical beamforming and their application in LiDAR, spectroscopy, telecom technologiesMore job opportunities
What can we do for you?
- Our unique state-of-the-art 50Gb/ silicon photonics platform offers you an advanced development and prototyping facility for the realization of your customized silicon photonics solutions. Accelerate your product roadmap and shorten your time-to-market by leveraging our integrated platform in close collaboration with our development teams.
Why work with us?
- Our industrial affiliation program in optical I/O gives you access to the industry’s most advanced pre-competitive research into next generation integrated photonics. Join our global R&D ecosystem and access the most innovative research results.
- Our in-depth silicon photonics technology and design knowledge is supported by our expertise centers in advanced material and component analysis, modeling, metrology, reliability, process steps, systems technology co-optimization and more.