Electrical fault isolation by ultrasonic stimulation
PhD - Leuven | More than two weeks ago
Develop new non-destructive defect localization solutions for failure analysis of next-generation IC technologies.
Failure analysis (FA) involves the systematic investigation to determine the root cause of a failure. In integrated circuit (IC) manufacturing, this process forms an important function to improve the reliability and quality of the product. The rising complexity of electronic systems, due to the continued geometric scaling and introduction of 3-D integration, poses new challenges for FA. The PhD research will concentrate on the development of new fault isolation techniques by exploring the application of ultrasonics. In particular, the successful candidate will develop a new experimental apparatus and perform characterization/evaluation on state-of-the-art IC technology from imec.
KU Leuven supervisor: Ingrid De Wolf (KU Leuven)
Location: Leuven
Focus of work: Metrology & characterization
The reference code of this topic is 2021-032. Please mention this on your application.
The next application window will be open from mid-March 2021 until mid-April 2021.
It is not possible to send in your application before mid-March 2021.