Electrochemical/Electroless Deposition for 3D Heterogeneous Integration

More than two weeks ago
Due to an increasing demand for high performance electronics, e.g. mobile, wearable, artificial intelligence for self-driving, heterogeneous 3D integration chips are highly desired since the integration scheme can be significantly outperforming a 2D integration chip. In addition, quantum computing with multiple qubits are expected to require 3D integration technology to connect separated qubits and interconnect cell. Electrochemical deposition is an essential process for heterogeneous 3D integration, due to its ability to fill high aspect ratio features with complex geometries at high deposition rates, leading to high throughput and lower manufacturing costs. The goal of this project is to develop thorough understanding of plating processes for possible applications in 3D integration, incl quantum application. We are interested in improving plating processes of current industry favorites such as Sn, Ni, Co, and Cu, but also developing plating processes for superconducting material for quantum applications. We would explore the ways to manipulate the morphology, surface roughness, chemical composition, etc. of the deposited structure, while maintaining optimal deposition rate and feature height uniformity across the characteristic length-scale. Thorough understanding of the plating mechanism and its effect on the morphology of both elemental structure/layers is to enable determination of deposition parameters needed to match design requirements for a given plated material and its applications.

Type of project: Internship

Supervising scientist(s): For further information or for application, please contact: Fumihiro Inoue (Fumihiro.Inoue@imec.be)

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