Expanded beam optical interface for high density optical interconnect

Photonic integrated circuits can be found in applications ranging from telecom, datacom, gas sensing to emerging fields such as LIDAR, AI, quantum computing and quantum communication. Key to enabling this technology is to provide an optical interconnection interface for fiber-to-chip, chip-to-fiber, and/or chip-to-chip communication. However, the small dimensions of optical features on chip allow for only a very limited alignment tolerance for interfacing optical fibers. Expanded beam interface, on the other hand, can greatly relax the stringent alignment tolerance and enable low-cost, high-throughput, high-density optical interconnects. This can be achieved by use of near field mode conversion optics in conjunction with free space beam shaping elements such as micro mirrors and/or micro lenses. Of special interest in this project is the opportunity to design and implement advanced optical couplers on silicon photonic chips with the support of imec 200mm and 300mm facility, and develop state-of-the-art laser fabrication techniques in UGhent for use in beam expansion optics.