How to reliably asses the reliability of interconnects?

More than two weeks ago

Challenging the good marriage between classical and new electromigration test methodologies.

Electromigration is a key reliability concern for advanced on-chip interconnects. Industry spends a lot of time and money to measure the impact of process variations on electromigration and to guarantee electromigration lifetime requirements. In recent years, imec and KUL developed a fast electromigration characterization method using low-frequency noise measurements and managed to establish a good link between the classical measurement methods and the newly developed one. This topic will built further on this work by extending our data base to a broader set of devices and test structures. This will allow to understand the application/limitation of the developed methodology which makes the visibility of this topic high both for academia and industry.

Type of project: Combination of internship and thesis

Duration: 6-12 months

Required degree: Master of Engineering Technology, Master of Science, Master of Engineering Science

Required background: Nanoscience & Nanotechnology, Physics

Supervising scientist(s): For further information or for application, please contact: Kristof Croes (

Imec allowance will be provided for students studying at a non-Belgian university.

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