Hyperspectral Data Mapping, Compression, and Feature Recognition or 3-D (HY-SPE3D) Imaging
What you will do
Hyperspectral modes of imaging are often replete in information that cannot be ascertained through conventional (i.e., spectrally unresolved) imaging. Emerging scientific disciplines and commercial systems are exploiting hyperspectral capabilities to realize innovations in diverse applications such as biomedical technology, agricultural monitoring, environmental engineering, and food inspection. The advantageous information obtained through these methodologies, however, comes at the expense of increased dataset size and computational complexity in feature extraction. Independently and concurrently, within the broader context of imaging, the importance and practical acquisition of 3D images has also grown significantly. In cases where comprehensive documentation is desired – such as in biological record-keeping, historical artifact preservation, and dimensional inspection – 3D documentation is quickly becoming the norm. Unsurprisingly, many disciplines and applications would benefit from the merger of hyperspectral and 3-dimensional (HY-SPE3D) metrology. However, advancements in this approach must confront the challenge it presents in data handling in addition to the pragmatic engineering challenges inherent in such data capture.
The work here will focus on one or more aspects of advancing this technology, including: 1) Optical system design and implementation for simultaneous capture of 3D/hyperspectral data capture, 2) compression of the dataset across the ‘spatio-spectral’ domain, and 3) methods of simplification of the dataset for the purposes of feature recognition and extraction. Initial subjects of study include arthropods, vegetation specimens, and model artifacts. Initial focus will be on microscopic or mesoscopic (i.e., just larger than common microscopes can accommodate) objects, but may grow in scope.
What we do for you
In exchange for your talent, passion and expertise, you will join an ambitious organization, with challenges there for the taking. This internship offers you the opportunity to work for imec, a globally recognized leader in high frequency electronics design. With the guidance of senior researchers, you will participate in a full design cycle. You will have an assigned mentor to guide you through this highly valuable, hands on learning experience. You will work with top researchers from imec and from our industry partners. We are a not for profit research institution where you can work across a variety of projects and topics. We work close to industry, so your expertise and efforts often convert to solutions that are widely utilized and make positive impacts in the world. Our progressive and informal working environment offers you a range of possibilities to take initiative. This is your opportunity to contribute to the technology that will determine the society of tomorrow. Your valuable contribution and that of your colleagues make imec a top player in its field.
Who you are
Hard requirements for this role are as follows:
- Currently enrolled in or a recent graduate from a relevant Master’s or PhD program in a competitive research university in a relevant discipline such as Photonics, Electronics or Physics.
- Proficient with at least one of the following: Matlab, C/C++, Python or comparable.
- Prior exposure to a lab environment and basic tenets of data collection.
- Reasonable proficiency in the basic MS Office applications (Word, PPT, Excel)
- Must be comfortable working as a team member.
- Must be motivated to contribute to their project in a meaningful way and willing to strive to see it to reasonable state of completion.
- Must be an active, not passive, learner who can independently seek out solutions to challenges encountered in addition to learning through the direction and mentorship provided by Imec senior researchers.
Desired skills and competencies include the following. The student need not be an expert in all categories, but must possess an interest and motivation to acquire skills and knowledge in each:
- A basic conceptual understanding of multispectral and hyperspectral imaging.
- Practical experience with imaging system design or selection, including evaluating lens characteristics, sensor properties, and an understanding of illumination effects.
- Knowledge of 3D imaging concepts is advantageous, including photogrammetry, triangulation methods, structured light, camera registration, and iterative closest point (ICP) algorithms.
- Experience with vision software libraries, such as OpenCV, and an understanding of basic principles of data compression is a plus.
It is the policy of imec to provide equal employment opportunities to all employees and employment applicants without regard to unlawful considerations of race, religion, color, national origin, ancestry, sex, sexual orientation, gender, gender identity or expression, genetic information, age, disability, medical condition, marital status, military or veteran status or any other classification protected by applicable local, state or federal laws. This policy applies to all aspects of employment, including, but not limited to, hiring, job assignment, compensation, promotion, benefits, training, discipline and termination. Reasonable accommodations of disability and religion are available for qualified individuals, upon request, provided that such accommodation does not present an undue hardship to imec.