Research & development - Leuven | More than two weeks ago
Over the last decade, optical communication has emerged as one of the key enablers for the exponential growth of cloud-based services. Servers inside today’s hyper scale data centers exchange incredible amounts of data over fiber optic links. The electrical signals from servers and switch ASICs are translated into optical signals that can be transmitted over fiber using sophisticated optical transceiver engines. As the data rates and overall complexity of such optical engines increases, silicon photonic based solutions prove to be the preferred platform. To build the next generation of transceivers and to enable exciting new technologies such as co-packaged optics (CPO), the density and level of integration of the transceiver engine will have to increase while at the same time lowering the total energy spent per bit. The light source is one of the critical components in making these next-gen optical interconnects a reality. Future optical links will run on densely spaced wavelength-division multiplexed (WDM) channels which in turn require advanced laser sources. Using today’s technology, building such sources requires advanced III-V processing which inevitably impacts yield and hence cost.
Recently, imec has made great progress in developing an ultra-high accuracy, high throughput, wafer scale process to integrate existing III-V devices onto its silicon photonic platform using flip-chip bonding. These advances provide a clear path towards novel device architectures where the active region of the laser consists of a reflective semiconductor optical amplifier (RSOA) and the wavelength selective mirror is defined in the silicon or silicon-nitride layer of the host photonic chip. This approach drastically reduces the complexity of the III-V device and will enable advanced laser sources such as high channel count (> 16), densely spaced WDM laser arrays for CPO or narrow linewidth tunable lasers for coherent communication at a fraction of today’s cost. Even more advanced multi-wavelength sources such as mode-locked lasers and Kerr comb lasers will be explored using the same technology platform.
In this postdoctoral position:
We offer you the opportunity to join one of the world’s premier research centers in nanotechnology at its headquarters in Leuven, Belgium. With your talent, passion and expertise, you’ll become part of a team that makes the impossible possible. Together, we shape the technology that will determine the society of tomorrow.
We are proud of our open, multicultural, and informal working environment with ample possibilities to take initiative and show responsibility. We commit to supporting and guiding you in this process; not only with words but also with tangible actions. Through imec.academy, 'our corporate university', we actively invest in your development to further your technical and personal growth.
We are aware that your valuable contribution makes imec a top player in its field. Your energy and commitment are therefore appreciated by means of a competitive scholarship.
This postdoctoral position is funded by imec through UGhent. Because of the specific financing statute which targets international mobility for postdocs, only candidates who did not stay or work/study in Belgium for more than 24 months in the past 3 years can be considered for the position (short stays such as holiday, participation in conferences, etc. are not taken into account).