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Improvement of die cleaning process for MEMS applications
Leuven | More than two weeks ago
Particles cumulated during IC processing can be detrimental for the IC functionality. This is very critical for MEMS applications where micromechanical movements are obstructed. This work prense the processing steps and the material used to mprove cleaning effciency and enable functional devices.
Type of project: Combination of internship and thesis
Required language: English
Required background: Electronics, Data analysis, Processing, IC, Matemathics, statistics
Mentor: Glen Maes
Manager: For more information or for application, please contact Antonio La Manna (Antonio.LaManna@imec.be)