/InP integrated circuit design for future THz communication systems

InP integrated circuit design for future THz communication systems

PhD - Leuven | More than two weeks ago

You will design building blocks of wireless transceivers that hit the 300 GHz barrier

Wireless communication is ubiquitous in our life. Today, the 5G standard is being deployed,

featuring higher data rates and lower latencies than its predecessor 4G. Imec has already started

research for 6G. 6G will feature even higher data rates than 5G, up to 100 Gbit/s and wireless

communication with a latency well below 1 millisecond. This will serve applications such as highresolution

augmented reality or virtual reality, 3D holographic communication, ...

To enable this, a huge bandwidth is needed much more than what 5G will need. Such bandwidth is

available above 100 GHz. Imec is already developing electronics for the D-band, which is between

110 GHz and 170 GHz. As the hunger for even higher data rates will not be satisfied, there will be a

need to reach out to even higher carrier frequencies. after the introduction, even higher bandwidths

will be needed.

Recently, IEEE released the IEEE 802.15.3d standard for wireless communication in the frequency

band from 275 GHz to 325 GHz. The large bandwidths available at these frequencies would enable

Tbps wireless communication. In this research, our vision is to use indium-phosphide (InP)

technology in combination with CMOS to combine the best of both worlds. Of course, a highly

integrated and energy efficient topology is required which creates a need to investigate circuits and architectures in InP at these very high frequencies.

In your PhD work you will focus not only on THz front-end architectures that are suited for

integration in an InP platform, but also on the circuit design, the implementation and the

measurements of critical blocks like a voltage-controlled oscillator (VCO), generation and

distribution of a local oscillator signal, low-noise amplifiers, efficient power amplifiers and wideband

circuit techniques. Together with the existing research teams at imec Leuven, imec Florida and KU

Leuven ESAT-MICAS, you will contribute to the 6G heterogeneous integration program of imec while

at the same time have the freedom to propose and develop your own ideas.

Required background: Master degree in Electrical Engineering

Type of work: 70% design and simulation, 20% experimental, 10% literature

Supervisor: Patrick Reynaert

Co-supervisor: Piet Wambacq

Daily advisor: Mark Ingels

The reference code for this position is 2023-083. Mention this reference code on your application form.

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