Integrated power converters using 3D integration technology

New methodologies for effective power distribution networks (PDN) at system level should be considered that incorporate the use of on-chip as well as off-chip components, such as capacitors, inductors and voltage regulators. Furthermore, 3D circuit integration has introduced more, new opportunities for PDNs. Alternative 3D stacking techniques with different 3D interfaces and the capability of integrating passive components such as capacitors, create a very dynamic design space with plenty of design options to optimize power supply integrity.

The objective of this PhD is to investigate integrated power converters using 3D integration technology. Firstly, the PhD starts by reviewing state-of-the-art converter topologies and investigate their compatibility with the constraints and advantages of 3D integration technology. Secondly, the work focuses on exploring alternative topologies and design methodologies to maximize performance of integrated converters taking advantage of the passive components and interconnect enabled by 3D integration. The objective is to understand the relation between technology choices and circuit performance through trade-off analysis and what-if studies. Thirdly, the optimized integrated converters are realized, produced and characterized in the lab to demonstrate their capabilities.

In this work, the candidate will interact with experts from industry and academia in different fields, including component and circuit modeling and simulation, technology development, and material characterization. This work involves a good understanding of models, and materials used in the semiconductor industry.