PhD - Leuven | More than two weeks ago
Extract the mechanical stress induced by 3D integration and assembly on integrated circuits.
Mechanical stress can arise in semiconductor ICs due to different reasons, such as packaging, 3D integration and environmental conditions. The goal of this PhD is to develop new ways of sensing and mapping this mechanical stress. In particular, several challenges have not been completely addressed in the state of the art: discrimination between the different components of the stress sensors (vertical versus in-plane), thermal stability of the sensor, robust embedded circuits with digital outputs and statistical analysis of stress sensor grids. In addition, to assess the impact of the mechanical stress on circuits and systems, new types of device developed at IMEC will be evaluated in terms of stress sensitivity. The assessment of stress sensitivity links the mechanical stress to their impact on systems.
Therefore, the thesis should cover the following aspects:
Required background: semiconductor engineering
Type of work: 40% data analysis, 40% characterization in the lab, 10% literature, 10% design
Supervisor: Ingrid De Wolf
Daily advisor: Gaspard Hiblot
The reference code for this position is 2020-035. Mention this reference code on your application form.
Chinese nationals who wish to apply for the CSC scholarship, should use the following code when applying for this topic: CSC2020-17.