CMOS and beyond CMOS
Discover why imec is the premier nanoelectronics R&D center in the development of industry-relevant solutions for advanced logic & memory devices.
Connected health solutions
Explore the technologies that will power tomorrow’s wearable, implantable, ingestible and non-contact devices.
Life sciences
As a pioneer in nanoelectronics, imec brings the power of chip technology to the world of healthcare.
Sensor solutions for IoT
Imec develops innovative solutions for sensor networks, high speed networks and sensor technologies for the Internet of Things.
Artificial intelligence
Artificial intelligence is no longer the stuff of science fiction: its technologies are ready and its possibilities are real. It’s time to explore them, and imec is ready to help you.
More expertises
Discover all our expertises.
Research
Be the first to reap the benefits of imec’s research by joining one of our programs or starting an exclusive bilateral collaboration.
Development
Build on our expertise for the design, prototyping and low-volume manufacturing of your innovative nanotech components and products.
Solutions
Use one of imec’s mature technologies for groundbreaking applications across a multitude of industries such as healthcare, agriculture and Industry 4.0.
Venturing and startups
Kick-start your business.Launch or expand your tech company by drawing on the funds and knowhow of imec’s ecosystem of tailored venturing support.
/Job opportunities/Mechanical stress sensing

Mechanical stress sensing

PhD - Leuven | More than two weeks ago

Extract the mechanical stress induced by 3D integration and assembly on integrated circuits.

Mechanical stress can arise in semiconductor ICs due to different reasons, such as packaging, 3D integration and environmental conditions. The goal of this PhD is to develop new ways of sensing and mapping this mechanical stress. In particular, several challenges have not been completely addressed in the state of the art: discrimination between the different components of the stress sensors (vertical versus in-plane), thermal stability of the sensor, robust embedded circuits with digital outputs and statistical analysis of stress sensor grids. In addition, to assess the impact of the mechanical stress on circuits and systems, new types of device developed at IMEC will be evaluated in terms of stress sensitivity. The assessment of stress sensitivity links the mechanical stress to their impact on systems.

Therefore, the thesis should cover the following aspects:

  • Testing of the stress sensors in the laboratory and calibration using mechanical setups
  • Analysis and parameter extraction from the sensor results
  • Analog/digital circuit development to compensate parasitic effects and combine sensor outputs into effective stress values


Required background: semiconductor engineering

Type of work: 40% data analysis, 40% characterization in the lab, 10% literature, 10% design

Supervisor: Ingrid De Wolf

Daily advisor: Gaspard Hiblot

The reference code for this position is 2020-035. Mention this reference code on your application form.
Chinese nationals who wish to apply for the CSC scholarship, should use the following code when applying for this topic: CSC2020-17.