Multi-Scale thermal modelling of new RF systems
PhD - Leuven | More than two weeks ago
Advanced thermal analysis to help 5G/6G amplifiers keep their cool
Thermal management is more than ever a concern for RF circuit designers. The development of efficient high-power amplifiers operating at mm-wave is crucial to enable the next generations of wireless communications (5G and 6G radios). Although a power amplifier with 50-percent efficiency may seem impressive, it is also burning one-half of the energy supplied to it, much of which is lost as heat. The resulting temperature raise impacts the amplifier performance and lifetime, as well as the surrounding circuitry. To mitigate thermal concerns, new materials are introduced to improve the power amplifiers efficiency, heat sinks are designed, efficient circuit-level and package-level solutions are envisioned.
The goal of this PhD is to develop multi-scale models to evaluate and optimize the thermal behavior of future RF technology platforms. This includes:
- Fundamental thermal modelling of the new device architectures and materials
- Transistor self-heating and thermal runaway modelling and characterization
- Thermal optimization of high-power amplifiers
- Methodologies for chip- and package-level thermal assessment and optimization.
KU Leuven supervisor: Piet Wambacq (VUB)
Daily advisor: Bertrand Parvais (imec)
Location: Leuven
Focus of work: Modeling
The reference code of this topic is 2021-060. Please mention this on your application.
The next application window will be open from mid-March 2021 until mid-April 2021.
It is not possible to send in your application before mid-March 2021.