New sensitive opto-mechanical technology and ultrasound sensors

More than two weeks ago

We are looking forward to exciting physics and applications of CMOS opto-mechanical devices!

Imec is developing an extremely efficient opto-mechanical photonic chip technology for application as ultrasound sensor to enable future photo-acoustic-imaging microsystems. The objective of this MSc thesis is to develop a physical model for this sensor including photonics, mechanics, acoustics, and non-linear effects. This includes significant theoretical work as well as experiments. It is expected to reveal interesting physics as well as potential new applications of this opto-mechanical technology.


The candidate is expected to have at knowledge about classical (cavity) opto-mechanics, optics/photonics and mechanics, or the ability to quickly learn and understand these topics. The candidate is expected to quickly grasp a complex physical system, model devices using analytical equations and/or numerical tools, and work towards the understanding of non-trivial experimental results.


During this internship, you will work with new opto-mechanical technology fabricated in CMOS technology. Devices are readily fabricated in Imec’s CMOS pilot-line on 200 mm wafers. Our laboratory is equipped with high-end photonic and micro-mechanic characterization equipment, which you will use for your experiments.


We are looking forward to exciting physics and applications of CMOS opto-mechanical devices!




Type of project: Thesis, Internship

Duration: 9-12 months

Required degree: Master of Engineering Technology, Master of Science, Master of Engineering Science

Required background: Nanoscience & Nanotechnology

Supervising scientist(s): For further information or for application, please contact: Wouter Westerveld (

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