During the last decade an enormous growth of applications in the field of information storage, telecommunication and life sciences has occurred. To sustain this growth, the amount of integrated circuits (IC) in our daily life is augmenting, ranging from computers, tablets, smart phones, smart TV's to smart cars, glasses, washing machines and healthcare devices. As of 2017, the largest transistor count in a commercially available single-chip processor is 19.2 billion. Continuous miniaturization of such electronic devices demands advanced and low-cost patterning strategies. Directed self-assembly (DSA), using block-copolymers (BCP), is considered an alternative technique to Extreme ultra-violet (EUV) lithography for patterning sub-20 nm pitch structures. One of the major challenges for the semiconductor industry is the pattern transfer of such sub-20 nm pitch features (printed either by DSA or EUV). In this work, the student will explore the capabilities of state-of-the-art plasma etch tools in order to transfer, sub-20 nm pitch DSA patterns with high fidelity . As the success of this work moves in a good direction the learning could be implemented on EUV photo resist patterning transfer.
The student will get an in-house training on plasma etch tool operation and working in a 300 mm clean room according to the safety rules. He/she will get familiar with experimental set ups, metrology tools and get a basic training and understanding of DSA and plasma etch. After few weeks the student must work in an independent manner. Our etch literature library will be available to help him/her understanding the etch processes and key parameters that control the process.
We are looking for a 1-year internship student at imec Leuven who shows good motivation and drive to understand the technology.
Type of project: Internship
Duration: 1 year
Required degree: Master of Engineering Technology, Master of Science, Master of Engineering Science, Master of Bioengineering
Required background: Chemistry/Chemical Engineering, Materials Engineering, Nanoscience & Nanotechnology, Physics
Imec allowance will be provided.