Senior Silicon Photonics Packaging R&D Engineer
Over the past several years, imec has developed a state-of-the-art silicon photonics (SiPh) technology for realizing next-generation optical interconnects as well as novel optical sensing applications. However, in order for SiPh to break into high-volume, low-cost applications, a cost-effective process for single-mode fiber packaging needs to be developed. As a Senior Silicon Photonics Packaging R&D Engineer, you will be the technical lead in the technology pathfinding for next-generation SiPh optical packaging, and you will work with imec’s photonic and 3D integration engineers to demonstrate such desired low-cost packaging solution. In order to achieve this goal, you will design innovative fiber coupling structures (including beam shaping and mechanical support structures), which will be fabricated using wafer-scale silicon processes in imec’s clean room. In addition, high-throughput wafer-scale fabrication or assembly of micro-optical components on the SiPh platform will be pursued. This work will be carried out in collaboration with material suppliers, vendors of optical fiber connectors, advanced semiconductor packaging/assembly tool vendors, as well as OSATs.
What you will do
Conceive novel concepts for low-cost fiber packaging through optical/mechanical design and modeling of SiPh coupling interfaces
Design a high-throughput monolithic/hybrid wafer-scale process flow to realize the designed interfaces in imec’s SiPh platform
Design process/layout experiments to drive technology development
Test, evaluate and qualify the developed packaging solution (optical/mechanical/reliability)
Drive project execution by interacting with integration, test & reliability engineers within imec, as well as with external vendors
Document and report to internal and external stakeholders including imec’s partners and customers
Report to the scientific community at conferences or in scientific journals
What we do for you
In exchange for your talent, passion and expertise, you will join a multicultural and high-tech company, with challenges there for the taking. Our flexible, progressive and informal working environment offers you a range of possibilities to take initiative and show responsibility. This is your opportunity to contribute to the technology that will determine the society of tomorrow. imec supports and guides you in this process; not only with words but with concrete actions. Through imec.academy, ‘our corporate university', we are actively investing in the further development of all our employees to assure their technical and personal growth. Your valuable contribution and that of your colleagues make imec a top player in its field. Your energy and commitment are therefore appreciated by means of an attractive and competitive salary with many fringe benefits.
Who you are
The ideal candidate has/is:
- Obtained a Ph.D. of Science in Mechanical Engineering, Electronics Engineering, Material Science Applied Physics (or equivalent experience through industry background)
- 4+ years hands-on experience in packaging and measuring fiber-coupled devices
- 3+ years hands-on experience with optical system design software, such as Synopsys (RSoft, Code V), Lumerical, Zemax, OSLO.
- Experience of CMOS Far BEOL wafer-scale processing and flip chip assembly (CoW, WLP, ...).
- Experience with silicon photonics is a plus
- An enthusiastic team player, yet able to independently solve complex problems with limited supervision.
- Excellent English communication skills and willing to work in a multicultural environment.