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/Job opportunities/Simulation of aging mechanisms in ultrathin hybrid nano-wires

Simulation of aging mechanisms in ultrathin hybrid nano-wires

PhD - Leuven | More than two weeks ago

Explore the aging mechanisms of imec's innovative nano-wires for future technology nodes.

Interconnects in an electronic chip endure high mechanical stresses, temperatures and current densities during fabrication and operation. The impact of these parameters has been widely investigated in the context of standard interconnect metals such as Al and Cu. However, multiple alternative metals such as Co, Ru, W, Mo, Ir are considered for future technology nodes where the Back-end-of-line will consist of a hybrid of such metals with wires thinner than 10 nm. This entails distinct aging mechanisms under the impact of thermal-mechanical stresses and high current densities involving microstructural changes and metal intermixing that need to be elucidated.

 

To this end, in this PhD project the candidate will work towards modelling and characterization of extremely thin hybrid nano-wires with alternative metals for use in future chips. Novel methodologies for numerical modelling and experimental characterization will be developed. This includes computational modelling using Finite Element Method (FEM) and Cellular Potts (CP) models and experimental investigation for model calibration and validation. In addition, complimentary ab initio simulations will be conducted to derive the fundamental physical parameters that may not be readily derived by means of experiments. The developed models will be integrated as a simulation platform to provide technological understanding and predictions in the context of reliability.

 

The position is best suited for candidates from engineering, material science or physics preferably with interest in modelling and multidisciplinary research. Experience with numerical methods and programming is a prerequisite.

 

Related reading:

 

[1] K Croes et al., Interconnect metals beyond copper: reliability challenges and opportunities. 2018 IEEE International Electron Devices Meeting (IEDM) 5.3. 1-5.3. 4.

[2] H Zahedmanesh et al., Investigating the electromigration limits of Cu nano-interconnects using a novel hybrid physics-based model, Journal of Applied Physics 126, 055102 (2019).

[3] M Kraatz et al., A model for statistical electromigration simulation with dependence on capping layer and Cu microstructure in two dimensions, Computational Materials Science 120 (2016) 29.

[4] YJ Lan, A mesoscale cellular automaton model for curvature-driven grain growth, Metallurgical and Materials Transactions B, 37B, (2006) 120.

[5] LE Spinella, The scaling and microstructure effects on the thermal stress and reliability of through-silicon vias in 3d integrated circuits, PhD thesis (2017).

[6] https://www.imec-int.com/en/imec-magazine/imec-magazine-september-2019/scaling-the-beol-a-toolbox-filled-with-new-processes-boosters-and-conductors)


 

Type of work: 20% Literature and technological study, 60% numerical modelling, 20% experimental characterization

 

Promotor: Prof. Ingrid De Wolf (KUL+imec)

Daily advisors: Dr. Ir. Houman Zahedmanesh (imec), Dr. Kristof Croes (imec), Prof. Hajdin Ceric (TUWien)

 

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proposal image.tif

 

Required background: The position is best suited for candidates from engineering, material science or physics preferably with interest in modelling and multidisciplinary research. Experience with numerical methods and programming is a prerequisite

Type of work: 20% Literature and technological study, 60% numerical modelling, 20% experimental characterization

Supervisor: Ingrid De Wolf

Co-supervisor: Houman Zahedmanesh

Daily advisor: Houman Zahedmanesh

The reference code for this position is 2021-001. Mention this reference code on your application form.

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