Leuven | More than two weeks ago
3D integrated circuits with vertical stacking of memory and logic blocks promise to leverage the system performance and scaling benefits. However, 3D ICs are more prone to thermal issues due to higher power densities.
As part of this work, we aim to perform system level thermal analysis for modern multicore high-performance computing (HPC)/server architectures and optimize the thermal performance with respect to various cooling solutions. The 3D Finite Element Modelling (3D-FEM) methodology in commercial TCAD tools provide powerful means to do thermal analysis by solving heat flow equations in 3 dimensions in complex structures. The student is expected to work with these TCAD tools to benchmark the thermal performance for advanced technology nodes. During the study, various system architecture partitioning schemes (memory-on-logic, logic-on-memory) will be explored w.r.t. the whole stack chip-substrate-package level considerations. In the process, the student is expected to closely work with system architects and thermal design team on exploring various system level thermal solutions.
Required background: Electrical /
Electronic engineering, Understanding SOC package design, Experience with
3D-FEM (TCAD) tools.
Type of work: 30% literature, 70% modelling
Daily advisor: Venkateswarlu Sankatali, Subrat Mishra, Dwaipayan Biswas
Type of project: Combination of internship and thesis
Duration: 6-9 months
Required degree: Master of Engineering Technology, Master of Science, Master of Engineering Science
Required background: Computer Science, Electrotechnics/Electrical Engineering, Physics
Supervising scientist(s): For further information or for application, please contact: Venkateswarlu Sankatali (Venkateswarlu.Sankatali@imec.be) and Subrat Mishra (Subrat.Mishra@imec.be) and Dwaipayan Biswas (Dwaipayan.Biswas@imec.be)
Imec allowance will be provided for students studying at a non-Belgian university.