PhD - Leuven | More than two weeks ago
The next generation of communication and radar systems will move beyond 100 GHz because of the need for higher performance, lower latency, small form factor, and lower cost. The traditional interconnect and packaging solutions
based on PCBs will not meet the requirements at such high frequencies. Thus, a cost-effective heterogeneous integration platform is essential for co-integrating mm-wave ICs in different technologies, such as III-V dies to provide power
or scaled CMOS for IF/baseband circuitry, enabling the co-design between package, RFIC, and antenna.
In this PHD, the focus will be the technology optimization of the imec heterogeneous integration platform. You will work together with 3D technology and RF experts on the co-optimization and downscaling of imec RF interposer technology,
to enable the innovative system concepts and system-technology co-design for the next generation of wireless communications
Required background: Electrical engineering, Nano and microelectronics, physics,
Type of work: 50% technology development, 20% modeling/simulation, 20% characterization, 10% literature
Supervisor: Dimitri Lederer
Daily advisor: Xiao Sun
The reference code for this position is 2023-067. Mention this reference code on your application form.