Technology optimization of heterogeneous integration platform for 6G applications

The next generation of communication and radar systems will move beyond 100 GHz because of the need for higher performance, lower latency, small form factor, and lower cost. The traditional interconnect and packaging solutions

based on PCBs will not meet the requirements at such high frequencies. Thus, a cost-effective heterogeneous integration platform is essential for co-integrating mm-wave ICs in different technologies, such as III-V dies to provide power

or scaled CMOS for IF/baseband circuitry, enabling the co-design between package, RFIC, and antenna.

In this PHD, the focus will be the technology optimization of the imec heterogeneous integration platform.  You will work together with 3D technology and RF experts on the co-optimization and downscaling of imec RF interposer technology,

to enable the innovative system concepts and system-technology co-design for the next generation of wireless communications

• Investigate the process ability of the alternative low loss low-K polymers, characterize their RF properties  
• Development of broadband characterization techniques and methods up to 300GHz
• Flip chip pitch/topology optimization
• Si substrate loss and mitigation technique
• Define the technology flow including TSV, MIM capacitor and Resistor
• Modelling/design of various passive components targeting for 100- 500GHz band
• Literature review and benchmarking the state of the art