Researcher for Wafer-to-Wafer Bonding
Miniaturization of system size is a driving force in most electronics applications. The continuous scaling of IC’s, and the advent of more compact system integration technologies make this possible. Within its affiliation programs and bilateral initiatives, imec contributes to the state of the art in a significant manner. Thanks to recent advances in 3D integration, wafer-level packaging and MEMS, novel types of components with small form factors and an increased number of functionalities are emerging. These novel components also require new packaging solutions. To support the growing interest in these activities, we are looking for a Researcher for Wafer-to-Wafer Bonding.
What will you do
You are member of the Bonding, Thinning and Assembly Team (BTA), which is responsible for developing processes requested by the process integration departments running imec’s CORE and CMORE programs. You work in a team of about nine people with whom you interact on a daily basis. You will work in a dynamic multidisciplinary and multicultural environment in close cooperation with Researchers, Scientists, Hardware Engineers, Operations, Equipment Vendors, Industrial Assignees, Device and Process experts.
As a researcher for permanent Wafer-to-Wafer Bonding, you will be responsible for developing specific bonding processes. Primarily, you are responsible for developing the processes that are required by imec’s programs. For this, you work mainly in the cleanroom and you are supported by experienced technical staff to carry out standard operations. Secondly, you are involved in research activities where bonding is required (3D, MEMS, biomedical devices).
More specifically, you will:
- Define, organize and validate process development for the wafer level bonding area and look for specific wafer-to-wafer bonding solutions.
- Actively contribute to the research programs (e.g. 3D program) and joint development programs with external partners. You will drive and define these JDP activities for new tool sets, new materials, new metrology tools and methodologies.
- Work cross-functionally with the integration/process support/hardware teams and industrial partners.
- Report about your work to internal and external partners, and via conference / journal publications.
- Perform characterization and failure analysis of wafer level bonding.
- Start fundamental research activities on the mechanisms of wafer to wafer bonding and analyze the wafer surfaces before boding,
- Monitor industry trends and innovations, applying scientific knowledge and adapting to imec research programs and activities.
- Interface with device engineers and researchers to identify the future needs and trends
- Coordinate and implement the non-standard work in IMEC’s fab organization together with fab process engineers and the pilot line. This includes coordination of the transfer of developed processes and tools to support and operational teams.
- Start-up of new equipment
You will be coached on-the-job by senior researchers.
What we do for you
In exchange for your talent, passion and expertise you will join a multicultural and high-tech company, with challenges there for the taking. Our flexible, progressive and informal working environment offers you a range of possibilities to take initiative and show responsibility.
This is your opportunity to contribute to the technology that will determine the society of tomorrow. imec supports and guides you in this process; not only with words but with concrete actions.
Through imec.academy, 'our corporate university', we are actively investing in the further development of all our employees to assure their technical and personal growth.
Your valuable contribution and that of your colleagues make imec a top player in its field. Your energy and commitment are therefore appreciated by means of an attractive and competitive salary with many fringe benefits.
Who you are
- You preferably have a PhD in Chemistry, Physics, Material Science or Engineering (or equivalent level through experience). 3-5 years of relevant experience within a research or industrial environment is an advantage.
- Foundry experience in wafer-to-wafer bonding and semiconductor materials background including characterization / FA is beneficial.
- You will require project management skills and a strong capability to work independently with a focus on quality for your deliverables.
- You will actively participate in cross-functional teams and projects when required, utilizing scientific and engineering skills to enhance the team capability.
- You are an enthusiastic and creative team player with strong networking, communication and reporting skills who likes to work in a multicultural team of imec researchers, PhD students and industrial researchers and will have frequently interactions with clients.
- You are working autonomously, well-organized, with a good attention to detail and you set high standards in everything you do.
- You are interested in working hands-on in a clean room environment.
- Since your job consists of a variety of activities, depending on the needs of the imec research programs, a flexible attitude towards your tasks is required.
- Given the international character of imec, good knowledge of (spoken and written) English is a must.