Upcoming events

The premier international forum for scientific and technical optics

The Surface Preparation and Cleaning Conference (SPCC) is a premier technical forum dedicated to advancing surface preparation, cleaning technologies, and wet processes essential to semiconductor manufacturing.

Flanders Investment & Trade (FIT), in collaboration with imec’s semiconductor-driven deeptech ventures collaboration model and imec.istart, is hosting FIT 4 imec; a focused visit program bringing innovative technology companies from Luxembourg, Bulgaria, Greece, Spain, and Austria to imec and Flanders ahead of ITF World 2026.

This event is designed to introduce FIT’s international network to imec’s world‑leading semiconductor R&D, its venture support ecosystem, and its broad capabilities across deeptech entrepreneurship, digital innovation, and semiconductor‑enabled technologies.

The program also includes a visit to ITF World 2026, providing participants with direct exposure to imec’s global community.

This is an invite‑only event. More agenda details will be announced soon.

The extreme conditions of space—including intense radiation, vacuum, extreme temperatures, and vibrational forces—pose immense challenges to the reliability and performance of any technology. Photonics is at the forefront of enabling missions to survive and thrive in these harsh environments. By developing radiation-hardened optics, cryogenic sensors, and robust laser communication systems, photonics ensures the enduring functionality of satellites, deep-space probes, and planetary exploration vehicles. These advancements are critical for scientific discovery, secure communication, and extending the lifespan of vital space infrastructure, pushing the boundaries of what’s possible beyond Earth.

Discover the future of AI at ITF world.

Discover how NanoIC’s IGZObased eDRAM PDK can accelerate your nextgeneration memory designs in a oneday workshop.

The Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) is an international conference for scientific and engineering exploration of thermal, thermomechanical and emerging technology issues associated with electronic devices, packages and systems.

The IEEE Electronic Components and Technology Conference (ECTC) is the premier international event that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange.

Join us for an in-depth workshop on NanoIC’s fine‑pitch redistribution layer (RDL) and die‑to‑wafer (D2W) hybrid‑bonding PDKs, co-organized by Europractice and the NanoIC pilot line.

Expanding AI with Leadership Silicon