Press releases

An overview of all imec press releases.

Partner related news

27 February 2017

Imec Presents Patterning Solutions for N5-equivalent Metal Layers

A step closer to High Volume Manufacturing Including Extreme Ultraviolet Lithography (EUVL)

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8 February 2017

Imec, Holst Centre and ROHM Present Breakthrough Solution for Ultra Low Power Internet of Things radios

All Digital Phase-Locked Loop Combines sub-mW power consumption, small size and industrial-grade performance

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7 February 2017

Imec, Holst Centre and Cartamundi Introduce Plastic Near Field Communication Tag Communicating with Smartphones

Innovative Tag is the Thinnest and Mechanically Most Robust Technology Compatible to ISO Protocols

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25 January 2017

Digimeter: Only 6,6% of Flemish people have no smart devices at home, new imec digimeter finds

On the downside: study reveals that more than one in three Flemish citizens is heavily dependent on their smartphone and/or social media; 13% suffer from ‘digibesity’

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19 January 2017

Imec and EVG demonstrate for the first time 1.8µm pitch overlay accuracy for wafer bonding

Breakthrough results pave the way to multi-layer 3D ICs with high density interconnects realized by automated wafer-to-wafer bonding technology.

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