20-21 March 2024
Siemens, Munich Neuperlach, Germany
By invitation only
On 20 and 21 March, representatives from all corners of the automotive ecosystem meet up for the third time to discuss how to jointly tackle the inevitable evolution towards chiplet architectures in cars.
This two-day event is organized by imec and hosted by Siemens. Participants will again come from OEMs, Tier 1s and Tier 2s, IDMs and foundries, IP and tool vendors, software companies, outsourced semiconductor assembly and test (OSAT) suppliers and design houses.
We sincerely hope you can join us and take part in the discussion.
Wednesday 20th March
Automotive chiplets customer perspective - Why and What before How, David Fritz, Vice President of Hybrid-physical and Virtual Systems, Automotive and Mil-aero at Siemens
Modular Testing of Chiplet-Based ICs with Standardized Design-for-Test - Po-Yao Chuang, Researcher at imec and Erik Jan Marinissen, Scientific Director at imec
Thursday 21th March
The Automotive Chiplet Alliance Conference is a live event, no virtual attendance will be accommodated. The conference will be hosted at Siemens, Munich Neuperlach.
A networking dinner will be hosted by Siemens on the evening of March 20, 2024. Capacity is limited, so please confirm your attendance via the registration form below.
Hotels in the vicinity of the conference venue:
Please find information on how to reach the conference venue and parking access. Please note parking is limited.
The dinner will take place at Knoedelalm