Build reliable, scalable, high-throughput and low-power network technologies by leveraging imec’s system-wide expertise.
Autonomous cars, smart medical implants, remote holography, ... All exciting future applications have at least one thing in common: they put new demands on our wired and wireless communication infrastructure.
To meet these demands, imec is working on next-generation connectivity technologies by innovating with novel semiconductor processes and across the system stack – from materials to circuits and algorithms – both in the analog and digital domains.
We’re countering the low efficiency of CMOS when dealing with ultra-high frequencies through heterogenous integration of III-V devices – especially indium phosphide – and advanced packaging to enable 6G. We enhance the accuracy and security of ultra-wide band and Bluetooth Low Energy through innovative algorithms and IC design, develop high-speed wireline. And much more.
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Shorten your time-to-market through our offering in white box IP (intellectual property) licenses that includes technology transfer, training, support.