2026 TSMC North America OIP Ecosystem Forum

IC-Link and imec will be participating in 2026 TSMC North America Open Innovation Platform (OIP) Ecosystem Forum, the ultimate collaborative hub where the world’s leading technology pioneers gather to discuss turning visionary ideas into reality.
IC-Link is imec's division for custom chip manufacturing, covering ASICs, PICs, custom wafer processing and advanced packaging. Join us to learn more on imec’s latest R&D breakthroughs and the manufacturing options through IC-Link: 

BOOTH #420

• TSMC Value Chain Alliance (VCA) member
• TSMC 3DFabric© Alliance Member
• TSMC Design Center Alliance (DCA) Member
   

PRESENTATIONS

• High-speed wireline data converters for beyond 100GBaud links in 5 and 3nm (online session)
  Lucas Moura Santana

• Designing with CoWoS S, CoWoS R and CoWoS L: package technology selection and co design for next generation heterogeneous systems
  Padma Nagaraja