/3D & system Summit

3D & system Summit

12 - 14 June 2024 | Dresden, Germany

Smarter systems through heterogeneous integration



Dimitrios Velenis, Head of the 3D and silicon photonics device and components group at imec will present on June 12th 5:55 pm - 6:15 pm on Heterogeneous Integration of Photonic Interconnects to Address AI Challenges – HiConnects

Scaling the bandwidth and energy efficiency of optical interconnects is addressing the growing needs of global data traffic and AI/ML applications within datacenters today. Combining optical interconnects with advanced packaging solutions is expected to be the answer for the extreme bandwidth density requirements for the upcoming AI applications. In this presentation, the steps taken in the HiConnects project to bring optical interconnects into advanced system packaging are discussed, together with a roadmap for serving both the computational and data bandwidth needs of AI applications through 3D integration of photonics and electronics.

Eric Beyne, Senior Fellow, VP R&D, Director 3D System Integration Program will have present on June 14th from 11h14-11h20 on Conference Reflections by 3D & Systems Summit Committee Chair

Event details

The SEMI 3D & Systems Summit this year is dedicated to Smarter Systems through Heterogeneous Integration. The semiconductor industry has had several changes in market, products, and technology brought by disruptive technologies and Moore's Law plateauing so continued development and innovation are required.

Industry experts will share their developments in 3D integration, and heterogeneous integration roadmap processes for semiconductor manufacturing and applications.

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