/3D & Systems Summit 2025

3D & Systems Summit 2025

June 17 - 19, 2026 | Dresden, Germany

Enabling next-gen heterogeneous systems integration

Imec will be participating in 3D & Systems Summit 2026, focused on exploring strategies for enhancing Europe's semiconductor industry, addressing topics as geopolitical dynamics, market trends, as well as the latest advancements in chiplet applications and hybrid bonding techniques. Join us to learn more on our latest breakthroughs and how to work with imec:  

BOOTH#18

  • NanoIC will showcase the advanced 300mm capabilities enabling innovation in logic, interconnects, and memory technologies.

     

PRESENTATION(S)

  • Kurt Herremans, Program Director Automotive
  • June 19th - 9h20-9h40
  • Autonomous Edge Chiplets: Building the Reference Platform for Scalable Edge Compute As compute demands continue to rise across automotive, robotics, aerospace and autonomous systems, chiplets are emerging as a critical path to scalable, affordable and interoperable edge platforms. In this presentation, Kurt Herremans of imec will outline imec’s Autonomous Edge Chiplet Program journey, from its automotive chiplet foundations toward a broader cross-industry architecture for autonomous edge applications. 
    The talk will cover the need for open chiplet standards, the evolution from automotive-focused programs to AECP/AECF, and imec’s work on quality, reliability, packaging, architecture and reference platforms. It will also highlight recent demonstrators, including QnR and architecture emulation activities, and introduce the Reference Architecture Specification as a practical recipe for building future autonomous edge chiplet ecosystems.