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/3D & system Summit

3D & system Summit

26 - 28 June 2023 | Dresden, Germany

Smarter systems through heterogeneous integration

imec

June 27th - 1:55 pm - 3:45 pm - Opening remarks and key takeaways during the Chiplet design packaging session by Eric Beyne, Senior Fellow, VP R&D, Director 3D System Integration Program at imec

June 27th - 4:55 pm - 5:15 pm - Micro-bump Technology Overview for 3D Heterogeneous Integration by Anne Jourdain, Principal Member of Technical Staff, Team Lead 3D Heterogeneous Integration at imec

June 27th - 6:25 pm - 6:45 pm - Topic Coming Soon by Natarajan Rajasekaran R&D Engineer, imec

Event details

The SEMI 3D & Systems Summit this year is dedicated to Smarter Systems through Heterogeneous Integration. The semiconductor industry has had several changes in market, products, and technology brought by disruptive technologies and Moore's Law plateauing so continued development and innovation are required.

Industry experts will share their developments in 3D integration, and heterogeneous integration roadmap processes for semiconductor manufacturing and applications.

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