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3D & Systems Summit 2025
June 25 - 27, 2025 | Dresden, Germany
Heterogenous Integration: Bolstering Europe’s Resilience
Imec
- Bivragh Majeed, R&D Manager for Heterogeneous and Implantable components group at imec will present on June 26th 12:40 pm - 1:00 pm on Enabling Advance Packaging Technologies for Biomedical Applications
- Kurt Herremans, Program director automotive chiplets, will present on June 26th 2:20 pm - 2:40 pm on Automotive Chiplet Program
- Eric Beyne, Senior Fellow, VP R&D, Program Director 3D System Integration will present on June 27th 11:55 am - 12:00 pm on Opening Remarks by Session Chair. He will also present the Key Takeaways and Conference Reflections on June 27 1:00 pm - 1:10 pm.
Event details
Themed Heterogenous Integration: Bolstering Europe's Resilience the 3D & Systems Summit 2025 will primarily focus on exploring strategies for enhancing Europe's semiconductor industry addressing topics as geopolitical dynamics, market trends, as well as the latest advancements in chiplet applications and hybrid bonding techniques. The Summit will feature an exclusive exhibition area, showcasing industry leaders alongside innovative emerging companies. This Summit is a platform for gathering and exchange of knowledge and fostering of collaborations within the semiconductor sector.