Advanced Metallization Conference 2025 (ADMETA 2025)
October 08 - 10, 2025 | Tokyo, Japan
ADMETA covers interconnect technology, including materials, processes, equipment, devices, circuit design, integration, characterization, assembly, and packaging. We will comprehensively discuss topics ranging from fundamentals to applications, together with researchers and engineers from industry, government, and academia.
imec
Presentation on BEOL interconnect technology in logic chips by Seongho Park, Program Director, Tokyo (Japan) on October 5.
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ADMETA covers interconnect technology, including materials, processes, equipment, devices, circuit design, integration, characterization, assembly, and packaging. We will comprehensively discuss topics ranging from fundamentals to applications, together with researchers and engineers from industry, government, and academia.