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Advanced PDK workshop: fine-pitch RDL & D2W hybrid bonding
May 27, 2026 | imec, Leuven, Belgium
Join us for a full-day workshop exploring NanoIC’s fine‑pitch redistribution layer (RDL) and die‑to‑wafer (D2W) hybrid‑bonding process design kits (PDKs), the first early‑access interconnect PDKs enabling high‑density, energy‑efficient chip‑to‑chip integration.
During this hands-on training, you’ll discover how these advanced packaging technologies unlock new capabilities for advanced system integration.
The program combines accessible introductory lectures with practical design exercises that guide you through the capabilities of the new RDL and D2W PDKs.
Interested in joining?
Find out more about the workshop
Date
May 27, 9 am – 6 pm
Venue
Imec 1, Kapeldreef 75, Leuven, Belgium