CMOS: advanced and beyond
Discover why imec is the premier R&D center for advanced logic & memory devices.
Integrated photonics
Take a look at technologies for optical transceivers, sensors and more.
Health technologies
See how imec brings the power of chip technology to the world of healthcare.
Sensing and actuation
Explore imec’s CMOS- and photonics-based sensing and actuation systems.
Connectivity technology
Look into our reliable, high-performance, low-power network technologies.
More expertises
Discover all our expertises.
Research
Be the first to reap the benefits of imec’s research by joining one of our programs or starting an exclusive bilateral collaboration.
Manufacturing
Go from idea to scalable and reliable semiconductor manufacturing with IC-Link.
Venturing
We create and co-create new ventures, and we invest in and accelerate existing ventures.
Education and workforce development
Imec supports formal and on-the-job training for a range of careers in semiconductors.
NanoIC pilot line
Aligned with the EU Chips Act, access to the pilot line will accelerate beyond-2nm innovation.
Applied Superconductivity Conference (ASC) 2026
September 06 - 11, 2026 | Pittsburgh, USA
A leading international conference showcasing the latest advances in applied superconductivity
Imec will be participating in Applied Superconductivity Conference (ASC) 2026, a leading international conference showcasing the latest advances in applied superconductivity.
Join us to learn more on our latest breakthroughs and how to work with imec:
PRESENTATIONS
- 2EOr3D-01: A Versatile NbTiN Superconducting Device Platform
2EOr3D: Fabrication I
Richard Rouse, Program Director Superconducting Digital - 4EOr2C-01: Advancements in fabrication and scaling of high-density aSi-NbTiN
4EOr2C: Josephson Junction Fabrication
Ankit Pokhrel, R&D Project Leader - 3EPo2A-01: [Invited] Multiphase AC Power Distribution for Large Scale Irregular JJ Circuits
3EPo2A: Digital Logic IV: Memory, Architectures
Steven Brebels, Principal microwave design engineer - 3EPo1C-01: Engineering NbTiN Film Thickness for Scalable Cryogenic Devices
3EPo1C: LTS Fabrication
Nunzio Francesco Buccheri, R&D Engineer - 2EOr3D-02: Pushing the scaling and performance limits of superconducting interconnects
2EOr3D: Fabrication I
Benjamin Huet, R&D Project Manager - 2EOr3D-05: Tailoring NbTiN thin films properties deposited on 300 mm silicon wafers for Superconducting Digital Circuit Integration
2EOr3D: Fabrication I
Daniel Perez Lozano, R&D Engineer