ECTC
30 May - 02 June 2023 | Orlando, Florida
The Electronic Components and Technology Conference (ECTC) is the premier international event that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange. ECTC is sponsored by the IEEE Electronics Packaging Society.
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Eric Beyne will moderate the session Copper Hybrid Bond Interconnections for Chip-toWafer Applications on Tuesday, May 30, 2023, 10:30 a.m. – 12:00 p.m
May 31st - 11:55 AM Advancements in Copper/Silicon-Oxide – New Cu Bulge-Out Mechanism Supporting Sub-Micron Scaling of Hybrid Wafer-to-Wafer Bonding - Eric Beyne – imec
June 1st - 11:55 AM - Wafer/Panel-Level and Advanced Substrate Technology – Thermal and Mechanical Characterization of Fan-Out Panel Level Packages by Use of Embedded Packaging Test Chips - Geert Van der Plas – imec
June 1st - 11:15 AM – Advanced Photonic Packaging and Interconnect Packaging of Ultra-Dynamic Photonic Switches and Transceivers for integration Into 5G Radio Access Network and Datacenter Sub-Systems - Geert Van Steenberge, Gunther Roelkens, Peter Ossieur, Jeroen Missinne – imec/Ghent University; Joris Van Campenhout – imec
June 2 - 11:15 AM - Materials Reliability – Reliability Investigations of Polymer Based Redistribution Layers (RDL) Protected by a Mold Layer - Eric Beyne – imec
June 2 - 2:00 PM -MEMS Sensor, Bio, and Advanced Interconnect Reliabiliy – Enabling Backside Processing
for Perforated Microfluidic Devices - Jakob Visker, Yang Han, Evert Visker, Chi Dang Thi Thuy, Mateusz Gocyla, Jan Ackaert, Aurelie Humbert, Serge Vanhaelemeersch, Lan Peng – imec
June 2 - 3:45 PM - Advances in RDL, Via, and TSV Technologies for Chiplet Integration – Ultra-Fine Pitch RDL (UFPRDL) Using Polymer Dual Damascene Processing- Nelson Pinho, Emmanuel Chery, Nicolas Pantano,
John Slabbekoorn, Andy Miller, Eric Beyne – imec
June 2 Bonding Assembly - Novel Packaging, Process, and Characterization - SiCN Waferto-Wafer Bonding and Impact of
Serena Iacovo, Oguzhan Orkut Okudur, Koen D’Have, Johan Meersschaut, Liesbeth Witters, Thierry Conard, Alain Phommahaxay, Steven Brems, Gerald Beyer, Eric Beyne – imec;
The following papers will be presented:
- May 31st - 10:00 AM - 12:00 PM - Electrochemical Deposition of Indium Bumps on Superconducting Interconnect and Thermo-Compression Bonding for Cryogenic and Quantum Computing
- Jaber Derakhshandeh – imec
- May 31st - 10:00 AM - 12:00 PM -Process Challenges During CVD Oxide Deposition on the Backside of 20-µm Thin 300-mm Wafers Temporarily Bonded to Glass Carriers
- Koen Kennes – imec
- Abdellah Salahouelhadj – imec
- Samuel Suhard – imec
- Jaber Derakhshandeh – imec
- Alain Phommahaxay – imec
- Steven Brems – imec
- Gerald Beyer – imec
- Eric Beyne – imec
- May 31st - 2:30 PM - 4:30 PM - An Investigation on Particle Embedding Capability of Wafer Level Spin-on Polymer Underfill Enabling Low Temperature Bonding of Hybrid Bonding System
- Jaber Derakhshandeh – imec
- John Slabbekoorn – imec
- Eric Beyne – imec
- June 1st - 2:30 PM - 4:30 PM - Inorganic Capping Layers in Advanced Photosensitive Polymer Based RDL Processes: Processing and Reliability
- Nelson Pinho – imec
- Emmanuel Chery – imec
- John Slabbekoorn – imec
- Mikhail Krishtab – imec
- Andy Miller – imec
- Eric Beyne – imec
- May 31st - 9:30 AM – 12:35 PM - New Cu Bulge-Out Mechanism Supporting Sub-Micron Scaling of Hybrid Wafer-to-Wafer Bonding
- Jo De Messemaeker – imec
- Liesbeth Witters – imec
- Boyao Zhang – imec
- Ferenc Fodor – imec
- Joeri De Vos – imec
- Gerald Beyer – imec
- Kristof Croes – imec
- Eric Beyne – imec
- June 1st - 9:30 AM – 12:35 PM - Thermal and Mechanical Characterization of Fan-Out Panel Level Packages by Use of Embedded Packaging Test Chips
- Vladimir Cherman – imec
- Geert Van der Plas – imec
- Friday June 2nd - 2:00 PM – 5:05 PM - Enabling Backside Processing for Perforated Microfluidic Devices
- Jakob Visker – imec
- Yang Han – imec
- Evert Visker – imec
- Chi Dang Thi Thuy – imec
- Mateusz Gocyla – imec
- Jan Ackaert – imec
- Aurelie Humbert – imec
- Serge Vanhaelemeersch – imec
- Lan Peng – imec
- June 2nd - 9:30 AM – 12:35 PM - Reliability Investigations of Polymer Based Redistribution Layers (RDL) Protected by a Mold Layer
- Emmanuel Chery – imec
- John Slabbekoorn – imec
- Julien Bertheau – imec
- Joke De Messemaeker – imec
- June 2nd - 2:00 PM – 5:05 PM -Enabling Backside Processing for Perforated Microfluidic Devices
- Jakob Visker – imec
- Yang Han – imec
- Evert Visker – imec
- Chi Dang Thi Thuy – imec
- Mateusz Gocyla – imec
- Jan Ackaert – imec
- Aurelie Humbert – imec
- Serge Vanhaelemeersch – imec
- Lan Peng – imec
- June 2nd - 2:00 PM – 5:05 PM - A Study of SiCN Wafer-to-Wafer Bonding and Impact of Wafer Warpage
- Serena Iacovo – imec
- Oguzhan Orkut Okudur – imec
- Koen D'Have – imec
- Johan Meersschaut – imec
- Liesbeth Witters – imec
- Thierry Conard – imec
- Alain Phommahaxay – imec
- Steven Brems – imec
- Gerald Beyer – imec
- Eric Beyne – imec
- June 2nd - 2:00 PM – 5:05 PM - Ultra-Fine Pitch RDL (UFPRDL) Using Polymer Dual Damascene Processing
- Nelson Pinho – imec
- Emmanuel Chery – imec
- Nicolas Pantano – imec
- John Slabbekoorn – imec
- Andy Miller – imec
- Eric Beyne – imec
Event details
The Electronic Components and Technology Conference (ECTC) is the premier international event that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange. ECTC is sponsored by the IEEE Electronics Packaging Society (formerly CPMT).
The technical program contains papers covering leading edge developments and technical innovations across the packaging spectrum. Topics include advanced packaging, modeling and simulation, Photonics, interconnections, materials and processing, applied reliability, assembly and manufacturing technology, components and RF, and emerging technologies. Both poster and presentation formats are used. Special papers presented at the ECTC will be awarded the Intel Best Student Paper Award and best and outstanding paper awards.
The Panel, Plenary, Special Sessions, and EPS Seminar provide the conference participants the opportunity to gain the insight and perspective of technical and business leaders.
The ECTC would not be possible without the sponsorship of the IEEE Electronics Packaging Society (formerly CPMT), numerous corporate participants and sponsors, and the time and energy of the more than 200 engineers and scientists on the ECTC Executive and Program Committees.