ECTC 2026
May 26 - 29, 2026 | Orlando, USA
The Electronic Components and Technology Conference (ECTC) is the premier international event that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange.
Imec
- Electrical Design and Analysis
Advanced Scalable Modeling of High-Q Passives on a 300 mm RF Interposer Platform for mmWave and sub-THz Applications
Session 05 RF and High-Speed Design for mmWave and Sub-THz
Come Wallner
- Assembly & Manufacturing Technology
Laser Assisted Bonding of InP Power Amplifier Chiplets on a 300 mm RF Si Interposer
Session 04 Breakthrough in Pitch Scaling With Advanced Bonding Technology
Damien Leech, R&D Engineer
- Interactive Presentations
Damascene Fine Pitch RDL Process Development of 1.0µm CD for Line/Space using High-NA i-Line Scanner
Session 38 Interactive Presentations - Photonics, mmWave Applications, and Emerging Technologies
Natalie Roels, Process Engineer
Integration and Characterization of Two Connection Schemes for Backside Power Delivery Network
Session 39 Interactive Presentations - Bonding Processes and Analysis in Next Generation Interconnects
Peng Zhao, Researcher
Understanding Scaling and Temperature Limits in Cu Bulge-Out Mechanism for Hybrid Wafer-to-Wafer Bonding
Session 39 Interactive Presentations - Bonding Processes and Analysis in Next Generation Interconnects
Joke De Messemaeker, R&D Group Lead Reliability and Electrical Characterization
- Materials & Processing
Nanoindentation-Based Analysis of Wafer-to-Wafer Bond Strength Using Cohesive Zone Modeling and Machine Learning
Session 18 Hybrid Bonding: Advanced Processing and Modeling
Yusuf Ozdemir, PhD Researcher
Fabrication and Transfer of Fine Pitch RDL Using Si Temporary Carrier Combined With IR Laser Release Approach
Session 21 Novel Laser-Based Technologies and Fine-Pitch Interconnects
Francois Chancerel, Principal Member of Technical Staff
Layer Transfer of Epitaxial Ru by Metal-Metal Bonding: Towards Single-Crystal Interconnects
Session 33 Emerging Materials and Interconnect Technologies for Advanced Packaging
Christoph Adelmann, Scientific Director
- Packaging Technologies
High Performance Direct Liquid Jet Impingement Cooling on Structured Silicon
Session 13 Advances in Thermal Design and Characterization
Herman Oprins, Scientific Director
Low distortion fusion bonding evaluation using pneumatically warped wafers
Session 31 3D Integration, TSV, and Hybrid Bonding Innovations
Utkarsh Jain, Wafer Bonding R&D engineer
- Thermal/Mechanical Simulation & Characterization
Mitigating the Thermal Bottleneck in Advanced BEOL Interconnects
Session 30 Thermal Management and Cooling Simulation
Xinyue Chang, Researcher
- Interconnections
Wafer-to-Wafer Hybrid Bonding Technology with 200nm Interconnect Pitch
Session 26 Advanced Wafer-to-Wafer Hybrid Bonding
Stefaan Van Huylenbroeck, PMTS 3D integration
Processing and Cold Testing of Superconducting and Thermal Conducting TSVs
Session 32 Solder and Through Via Interconnections: Material & Process Innovations
Anish Dangol, R&D Engineer
SESSION CHAIRS
Electrical Design and Analysis, Session 05 RF and High-Speed Design for mmWave and Sub-THz
Xiao Sun, Principal Member of Technical Staff
Interconnections, Session 26 Advanced Wafer-to-Wafer Hybrid Bonding
Anne Jourdain, R&D Manager
Event details
Bring your networking to the next level at ECTC! With technical sessions, panels, interactive presentations, a high energy exhibition floor, luncheons, evening receptions, and numerous coffee breaks you can connect with peers and leaders from semiconductor and electronics manufacturing, foundries and OSATs, substrate and materials suppliers, equipment makers, research institutions, design houses, and universities.