CMOS: advanced and beyond
Discover why imec is the premier R&D center for advanced logic & memory devices.
Integrated photonics
Take a look at technologies for optical transceivers, sensors and more.
Health technologies
See how imec brings the power of chip technology to the world of healthcare.
Sensing and actuation
Explore imec’s CMOS- and photonics-based sensing and actuation systems.
Connectivity technology
Look into our reliable, high-performance, low-power network technologies.
More expertises
Discover all our expertises.
Research
Be the first to reap the benefits of imec’s research by joining one of our programs or starting an exclusive bilateral collaboration.
Manufacturing
Go from idea to scalable and reliable semiconductor manufacturing with IC-Link.
Venturing and startups
Kick-start your business. Launch or expand your tech company by drawing on the funds and knowhow of imec’s ecosystem of tailored venturing support.
Education and workforce development
Imec supports formal and on-the-job training for a range of careers in semiconductors.
NanoIC pilot line
Aligned with the EU Chips Act, access to the pilot line will accelerate beyond-2nm innovation.
ECTC 2026
May 26 - 29, 2026 | Orlando, USA
The Electronic Components and Technology Conference (ECTC) is the premier international event that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange.
Imec
- 'Nanoindentation-Based Analysis of Wafer-to-Wafer Bond Strength Using Cohesive Zone Modeling and Machine Learning', session Hybrid Bonding: Advanced Processing and Modeling, by Yusuf Burak Ozdemir, PhD Researher, imec, on May 28 at 09:30.
Event details
Bring your networking to the next level at ECTC! With technical sessions, panels, interactive presentations, a high energy exhibition floor, luncheons, evening receptions, and numerous coffee breaks you can connect with peers and leaders from semiconductor and electronics manufacturing, foundries and OSATs, substrate and materials suppliers, equipment makers, research institutions, design houses, and universities.