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/ECTC 2026 (IEEE Electronic Components and Technology Conference)

ECTC 2026 (IEEE Electronic Components and Technology Conference)

March 26 - 29, 2026 | Orlando, Florida, USA

Build relationships, meet customers and collaborators, discover suppliers and new partners – all within four days that bring together the entire microelectronics packaging community.

Imec

  • 'Wafer-to-Wafer Hybrid Bonding Technology with 200nm Interconnect Pitch' by Stefaan Van Huylenbroeck, PMTS 3D integration, imec, date tbc

Event details

Bring your networking to the next level at ECTC! With technical sessions, panels, interactive presentations, a high energy exhibition floor, luncheons, evening receptions, and numerous coffee breaks you can connect with peers and leaders from semiconductor and electronics manufacturing, foundries and OSATs, substrate and materials suppliers, equipment makers, research institutions, design houses, and universities.

Build relationships, meet customers and collaborators, discover suppliers and new partners – all within four days that bring together the entire microelectronics packaging community. See you at the IEEE 76th Electronic Components and Technology Conference (ECTC), May 26-29, 2026, in Orlando, Florida! 

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