/EPIC Meeting on CMOS Compatible Integrated Photonics at imec

EPIC Meeting on CMOS Compatible Integrated Photonics at imec

07 - 08 September 2022 | Leuven, belgium

Imec

Agenda

DAY 0, Tuesday 6 September 2022

Pre-event dinner for early arrivals (optional) @hotel restaurant or nearby

DAY 1, Wednesday 7 September 2022

12:00 – 13:00 Registration & Light lunch @ imec

13:00 – 13:05 Welcoming words – EPIC

13:05 – 13:15 Welcoming words – imec

13:15 – 15:15 SESSION 1: Setting up the scene

13:15 – 13:45 KEYNOTE: imec

13:45 – 15:15 PRESENTATIONS

15:15 – 16:00 Coffee Break – Networking

16:00 – 18:30 SESSION 2 The Integrated Photonics Ecosystem

18:45 Bus transfer from imec to dinner venue

19:00 – 22:00 Dinner (venue TBA) 22:15 Bus transfer to Hotel

DAY 2, Thursday 8 September

08:00 Bus/walk from Hotel to imec

08:15 – 08:55 Morning Coffee @imec

09:00 – 11:15 SESSION 3 Traditional Photonics  Applications

09:00 – 09:10 Recap of Day 1 – EPIC

09:10 – 09:40 KEYNOTE

09:40 – 10:40 PRESENTATIONS

10:40 – 11:15 Coffee Break – Networking

11:15 – 13:30 SESSION 4: Emerging Applications

13:30 – 14:30 Lunch – Networking

14:30 – 16:00 COMPANY VISIT @ imec

16:00 Departure from imec to airport

The recommended hotel for all participants will be announced soon. All bus transfers will be organized to and from this hotel only. Hotel to be paid by each participant individually.

Event details

The EPIC Meeting on CMOS compatible integrated photonics at imec will bring together CMOS/Silicon/Electronics/MEMs foundries and manufacturers and providers of new materials with photonic functionality (Graphene, III-V, plasmonic structures, BTO, etc.) to address the needs to start new collaborations. The incorporation of new materials with photonic functionality to CMOS processing has been traditionally challenging. However recently, there has been major interest in bringing the developments in photonics to mass production, and for that, working closer to semiconductor companies is a necessary step.

Some of the recent trends are for example, the mass production of coherent transceivers for FMCW LiDAR, efficient detectors based on Quantum dots for next generation imagers, Intel hybrid IIIV/Si laser integration, Graphene flagship, and GF 300mm platform. At this meeting we would like the necessary steps to start new collaborations towards pilot production of these hybrid new platforms. Challenges to be addressed, such as through silicon/glass vias, wafer bonding, wafer testing, packaging & assembly as well as new market driven applications that demand the functionality beyond the state of the art.

More details

Register now