EPIC Meeting on CMOS Compatible Integrated Photonics at imec
07 - 08 September 2022 | Leuven, belgium
Imec
Agenda
DAY 0, Tuesday 6 September 2022
Pre-event dinner for early arrivals (optional) @hotel restaurant or nearby
DAY 1, Wednesday 7 September 2022
12:00 – 13:00 Registration & Light lunch @ imec
13:00 – 13:05 Welcoming words – EPIC
13:05 – 13:15 Welcoming words – imec
13:15 – 15:15 SESSION 1: Setting up the scene
13:15 – 13:45 KEYNOTE: imec
13:45 – 15:15 PRESENTATIONS
15:15 – 16:00 Coffee Break – Networking
16:00 – 18:30 SESSION 2 The Integrated Photonics Ecosystem
18:45 Bus transfer from imec to dinner venue
19:00 – 22:00 Dinner (venue TBA) 22:15 Bus transfer to Hotel
DAY 2, Thursday 8 September
08:00 Bus/walk from Hotel to imec
08:15 – 08:55 Morning Coffee @imec
09:00 – 11:15 SESSION 3 Traditional Photonics Applications
09:00 – 09:10 Recap of Day 1 – EPIC
09:10 – 09:40 KEYNOTE
09:40 – 10:40 PRESENTATIONS
10:40 – 11:15 Coffee Break – Networking
11:15 – 13:30 SESSION 4: Emerging Applications
13:30 – 14:30 Lunch – Networking
14:30 – 16:00 COMPANY VISIT @ imec
16:00 Departure from imec to airport
The recommended hotel for all participants will be announced soon. All bus transfers will be organized to and from this hotel only. Hotel to be paid by each participant individually.
Event details
The EPIC Meeting on CMOS compatible integrated photonics at imec will bring together CMOS/Silicon/Electronics/MEMs foundries and manufacturers and providers of new materials with photonic functionality (Graphene, III-V, plasmonic structures, BTO, etc.) to address the needs to start new collaborations. The incorporation of new materials with photonic functionality to CMOS processing has been traditionally challenging. However recently, there has been major interest in bringing the developments in photonics to mass production, and for that, working closer to semiconductor companies is a necessary step.
Some of the recent trends are for example, the mass production of coherent transceivers for FMCW LiDAR, efficient detectors based on Quantum dots for next generation imagers, Intel hybrid IIIV/Si laser integration, Graphene flagship, and GF 300mm platform. At this meeting we would like the necessary steps to start new collaborations towards pilot production of these hybrid new platforms. Challenges to be addressed, such as through silicon/glass vias, wafer bonding, wafer testing, packaging & assembly as well as new market driven applications that demand the functionality beyond the state of the art.