EPTC 2025
December 02 - 05, 2025 | Singapore
The IEEE Electronics Packaging Technology Conference (EPTC) is an annual international event organized by the IEEE RS/EPS/EDS Singapore Chapter and co-sponsored by the IEEE Electronics Packaging Society (EPS). Since its inauguration in 1997, EPTC has been established as a highly reputable international electronics packaging conference and is the IEEE EPS flagship conference in the Asia and Pacific Region.
Imec
- A.2.3 (P302) Mitigating Connected PAD Corrosion in Hybrid Bonding
Chew, Soon Aik
- B6.3 (P173) Is Flash Lamp Annealing a Relevant Wafer Debonding Technique?
Jedidi, Nader
- B.6.4 (P301) Cost efficient Infrared Laser debonding technology enabled by Si carrier reuse
Chancerel, Francois
- 5.2 (P180) Cu/SiCN wafer-to-wafer hybrid bonding interface reliability down to 400 nm pitch
Zhang Boyao
About
The IEEE Electronics Packaging Technology Conference (EPTC) is an annual international event organized by the IEEE RS/EPS/EDS Singapore Chapter and co-sponsored by the IEEE Electronics Packaging Society (EPS). Since its inauguration in 1997, EPTC has been established as a highly reputable international electronics packaging conference and is the IEEE EPS flagship conference in the Asia and Pacific Region.