IEEE International Interconnect Technology Conference (IITC) 2026

Imec will be participating in the 29th edition of the IEEE International Interconnect Technology Conference (IITC), the premier conference for interconnect technology devoted to leading-edge research in the field of advanced metallization and 3D integration for ULSI IC applications.

Join us to learn more on our latest breakthroughs and how to work with imec: 

PRESENTATIONS

• PAPERS
  • 3.3 Extending the scaling and performance potential of BEOL Superconducting NbTiN interconnects
    Session 3: Contacts to CMOS Devices & Novel/Emerging Technologies I
    Benjamin Huet, Ankit Pokhrel, Gilles Delie, Nunzio Buccheri, Adham Elshaer, Daniel Perez Lozano, Sarkar Sujan Kumar, Zhang Luke, Ravi Tiwari, Seifallah Ibrahim, Blake Hodges, Julian Gil Pinzon, Peter Koufalis, Terry Kim, Oleksandr Hryhorenko, Trent Josephsen, Sabine O'Neal, Anne-marie Valente, Zsolt Tokei, Richard Rouse – Imec
  • 4.3 Correction strategies for global and local bonding distortion in wafer backside 3D applications
    Session 4: 3D Integration & Packaging I
    Victor M. Blanco Carballo, Alex hsu, Vincent Renaud, Rami Chukka, Arup Saha, Cyrus Tabery, Etienne De Poortere, Idan Raiter, Itay davidovitch, Gorhad Kujan, Ofir Sharoni – Imec
  • 5.3 High-Aspect-Ratio Ruthenium Etch Optimization for Metal Pitch 18 Dual-Direct Metal Etch
    Session 5: Material & Process I
    Yiting Sun, Yanan Li, Vincent Renaud, Gilles Delie, Giulio Marti, Serena Rollo, Davide Tierno, Yannick Hermans, Evi Vrancken, Bart Kenens, Ivan Erofeev, Stefan Decoster, Chen Wu, Seongho Park – Imec
  • 7.4 Process-Induced Effects on TDDB Lifetime of MP18 DME Ru Interconnects
    Session 7: Reliability / Failure Analysis / Integration
    Alicja Lesniewska, Gilles Delie, Stefan Decoster, Koen Van Sever, Olalla Varela Pedreira, Chen Wu, Seongho Park – Imec
  • 8.4 Integration of Ru Direct Metal Etch Interconnect with Cu Single Damascene: transition from Ru layer to Cu layer
    Session 8: Advanced Interconnects II
    Rollo, Serena; Marti, Giulio; Delie, Gilles; Sun, Yiting; Montero, Daniel; Kumar Mandal, Akhilesh; Varela Pedreira, Olalla; Wu, Chen; Park, Seongho – Imec
  • 9.3 Ultra-low resistivity PtCoO2 Delafossite thin films via multilayer epitaxy for advanced interconnects
    Session 9: Material & Process II
    Jean-Philippe Soulie, Kerry Hazeldine, Silvia Armini, Johan Swerts, Chen Wu, Seongho Park, Zsolt Tokei, Christophe Adelmann – Imec
  • 10.2 IR-drop-based Electromigration-Compliance Checks of Grid Unit-Cells in Power Delivery Networks
    Session 10: DTCO & Modeling
    Simone Esposto, Hosain Farr, Leslie Grate, Tony Chavez, Mischa Thesberg, Helena Schneider, Ivan Ciofi, Giuliano Sisto, Kristof Croes, Dragomir Milojevic, Houman Zahedmanesh – Imec
  • 10.4 Finite element analysis of airgap mechanical stability in Ruthenium nano-interconnects
    Session 10: DTCO & Modeling
    Abdellah Salahouelhadj, Yao Yao, Kris Vanstreels, Gilles Delie, Giulio Marti, Oguzhan Orkut Okudur, Mario Gonzalez, Chen Wu, Seongho Park – Imec
  • 12.2 Novel Temporary Bonding and Debonding Process based on 365 nm UV for Advanced Packaging
    Session 12: 3D Integration & Packaging II
    Abhaysinha Patil, Takuya Fukuda, Koen Kennes, Cuypers Dieter, Violeta Georgieva, Alain Phommahaxay, Gerald Beyer, Eric Beyne, Zsolt Tokei – Imec
  • 13.2 Dual Direct Metal Etch for Reliable and Extendable Advanced BEOL Interconnect
    Session 13: Patterning & Metrology
    Giulio Marti, Gilles Delie, Yanan Li, Yiting Sun, Serena Rollo, Davide Tierno, Bart Kenens, Alicja Lesniewska, Olalla Varela Pedreira, Yannick Hermans, Akhilesh Kumar Mandal, Ivan Erofeev, Vincent Renaud, Stefan Decoster, Chen Wu, Seongho Park – imec
  • 13.3 Electrical validation of high-NA single patterning insertion for 1.4nm node
    Session 13: Patterning & Metrology
    Guillaume Schelcher, Marc Demand, Souta Nishimura, Bart de Wachter, Yusuke Wako, thiam arame, Kathleen Nafus, Kouta Furuichi, Etienne De Poortere, Cyrus Tabery, Victor M. Blanco Carballo – Imec
  • 13.4 Defectivity Propagation Study in MP18 Ru SID SADP Through e-Beam Inspection
    Session 13: Patterning & Metrology
    Gilles Delie, Ganesha Durbha, Davide Tierno, Stefan Decoster, Evi Vrancken, Vincent Renaud, Mahmudul Hasan, Giulio Marti, Stéphane Lariviere, Roel Gronheid, Chen Wu, Seongho Park – imec
  • 14.2 CMP Challenges in Dual Direct Metal Etch approach at 18-nm Pitch
    Session 14: Material & Process III
    Bart Kenens, Giulio Marti, Gilles Delie, Yanan Li, Yiting Sun, Serena Rollo, Davide Tierno, Alicja Lesniewska, Olalla Varela Pedreira, Yannick Hermans, Akhilesh Kumar Mandal, Ivan Erofeev, Vincent Renaud, Stefan Decoster, Chen Wu, Seongho Park – imec
  • 15.1 Determining contact resistance at 42nm pitch of contact metal on highly doped Si:P in a shortloop flow
    Session 15: Contacts to CMOS Devices & Novel/Emerging Technologies II
    Philippe Marien, Karen Stiers, Gianluca Martini, Yannick Hermans, Tanushree Sarkar, Vincent Brissonneau, Heath Huang, Nicolas Jourdan, Matthias Vuurstaek, Bart Kenens, Jelle Vande Weeghde, Evi Vrancken, Sven Dewilde, Kevin vandersmissen, nancy heylen, Bart de Wachter, Yaksh Rawal, erik rosseel, Anjani Akula, Cassie Sheng, Gilles Delie, Chan BT, Juergen Boemmels, Maryamsadat Hosseini, Chen Wu, Seongho Park – imec
• POSTERS
  • P1. Integrating Single-Crystal Ruthenium in Advanced Interconnects by Layer Transfer
    Poster Session and Conference Reception
    Christophe Adelmann, Jean-Philippe Soulie, Francois Chancerel, Steven brems, Anurag Vohra, Pawan Kumar, Benjamin Groven, Rajat Gujrati, Souvik Ghosh, Peter Kerepesi, Michael Dornetshumer, Florian Medl, Tobias Wernicke, Christoph Floetgen, Chen Wu, Seongho Park – Imec
  • P2. Electrochemically Deposited Fine-Grain (fg-)Cu for Hybrid Bonding Applications
    Poster Session and Conference Reception
    Chih-Hao Hsia, SungHo Park, Soichi Watanabe, Marco Arnold, Aleksandar Radisic, Herbert Struyf, Jo De Messemaeker, Zaid El-Mekki, Punith Kumar Mudigere Krishne Gowda, Sven Dewilde, Olivier Richard, Serena Iacovo – imec
  • P15. Impact of Forming Gas Annealing on the Structural and Electrical Properties of PtCoO2
    Poster Session and Conference Reception
    Kerry Hazeldine, Jean-Philippe Soulie, Liam Dwyer, Alex S Walton, Chen Wu, Seongho Park, Christophe Adelmann, Silvia Armini – Imec