/IEEE International Interconnect Technology Conference (IITC) 2025

IEEE International Interconnect Technology Conference (IITC) 2025

June 02 - 05, 2025 | Busan, Korea

Premier conference for interconnect technology devoted to leading-edge research in the field of advanced metallization and 3D integration for ULSI IC applications.

Imec

  • Blake Hodges, superconducting design engineer, is an invited speaker, delivering the presentation: "Optimized two metal level semi-damascene interconnects for superconducting digital logic".
  • Giulio Marti, R&D engineer, is an invited speaker, delivering the presentation: "Advancing pillar-based FSAV integration of Ru interconnect to enlarge the process window and enable multi-layers of high-aspect ratio".
  • Peng Zhao, R&D Engineer,  Integration of through-dielectric-via on buried power rail and slit nano through-silicon-via for enhanced backside connectivity on 4th June, 16:20-16:40
  • Abhaysinha Patil, R&D Engineer - Wafer Assembly & Packaging will present on  Evaluation of warpage tolerance of 100 µm dies to achieve void-free bond and 100% assembly yield on June 3, 13:55 – 14:15

     

About

The 28th edition of the International Interconnect Technology Conference (IITC) will be held at the Westin JOSUN Busan hotel in Busan, Korea on June 2-5, 2025. This is the first IEEE IITC 2025 held in Korea. Authors are encouraged to submit their original work describing Innovative research and development in the critically important field of on-chip interconnects. The conference seeks papers on all aspects of BEOL/MOL interconnects and metallization, including design, unit process, integration and reliability. IEEE IITC 2025 is sponsored by the IEEE Electron Devices Society as the premier conference for interconnect technology devoted to leading-edge research in the field of advanced metallization and 3D integration for ULSI IC applications.

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