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NanoIC pilot line
Aligned with the EU Chips Act, access to the pilot line will accelerate beyond-2nm innovation.
IEEE ITherm Conference 2026
May 26 - 29, 2026 | Orlando, USA
The Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) is an international conference for scientific and engineering exploration of thermal, thermomechanical and emerging technology issues associated with electronic devices, packages and systems.
Imec
- 'Impact of Warpage on the Thermal Performance of Large Multi-Chiplet Packages A Coupled Thermal and Mechanical Analysis', session: Advanced Packaging/HI Thermal Management' by Onur Yenigun, R&D Engineer, imec.
- 'Transistor Level, Geometry-Driven Thermal Management in FinFET and FDSOI Technology', by Lisa Tondelli, Researcher, imec.
- 'Dynamic Modelling of the Thermal Instability of Electro-Absorption Modulators; Theoretical Investigation of Targeted Thermo-Electric Hot Spot Cooling in CPUs', by David Coenen, Senior Researcher, imec.
Event details
Sponsored by the IEEE’s Electronics Packaging Society (EPS), ITherm 2026 is an international conference for scientific and engineering exploration of thermal, thermomechanical and emerging technology issues associated with electronic devices, packages and systems.