IEEE Optical Interconnects and Packaging (OIP) Conference

Imec will be participating in IEEE Optical Interconnects and Packaging (OIP) Conference 2026, a single track, collaborative event dedicated to solving the future of high-density optical interconnects and packaging including evolving applications in: High speed 200G/400G SerDes, energy efficient high density scale up/out interconnects, optical packaging and 3D-IC integration and next generation optical devices enabling high speed/low power. Join us to learn more on our latest breakthroughs and how to work with imec: 

PRESENTATION

• Advanced Ge/Si Devices and Wafer-Scale Assembly for CPO and 3D Optical I/O (Invited) 
  We will discuss our recent R&D advances in Ge/Si (avalanche) photodetectors and GeSi FK EAMs, targeting both 400G/lane “Fast-and-narrow” CPO and future “Wide-and-Slow” 3D Optical I/O. For the latter, we will also outline our vision for wafer-level optical interconnects and share some recent results in advanced “optical die-to-wafer” assembly.
  Joris Van Campenhout, Program Director Optical I/O