Imec at 2022 IEEE International Solid-State Circuits Conference
20 - 26 February 2022 | Virtual
Imec is present at the 2022 IEEE International Solid-State Circuits Conference and will announce two breakthrough results, one on flexible microprocessors in thin-film transistor technology and one on impulse-radio ultra-wideband technology with record-high data rates. Two experts will have talks at the ISSCC 2022 fora: Nadine Collaert will talk about Emerging Device and Heterogenous Integration Technologies for sub-THz Applications at the ‘Path to 6G’ forum and Joris Van Campenhout will discuss Silicon Photonics Technology for Next-Generation Transceivers at the ‘Paving the Way to 200Gb/s Transceivers’ forum.
Talks
Forum 3 - The Path to 6G: Architectures, Circuits, Technologies for Sub-THz Communications, Sensing, and Imaging
Emerging Device and Heterogenous Integration Technologies for sub-THz Applications - Nadine Collaert
In this talk, we will discuss the benefits of InP for sub-THz applications and the path to enable mature and cost-efficient hybrid InP/CMOS technologies, thereby using the System-Technology Co-Optimization (STCO) methodology to guide the technology choices depending on the constraints set by the system-level requirements.
Forum 4 - Paving the Way to 200Gb/s Transceivers
Silicon Photonics Technology for Next-Generation Transceivers - Joris Van Campenhout
We discuss recent progress in silicon photonics technology targeting Tbps-scale optical interconnects for next-generation datacenter network switches and HPC/AI systems. We will cover high-speed photonic components, including Si Mach-Zehnder and Si ring modulators, as well as GeSi electro-absorption modulators, featuring modulation bandwidths as high as 50GHz. We will also discuss the integration of high-speed RF Through-Si Via’s (TSV) in a silicon-photonics interposer platform. Finally, we will give a few examples of early transceiver demonstrations using the described optical components.
Imec program overview
Tuesday 22 February 2022
Session 12
A 256-Channel Actively-Multiplexed μECoG Implant with Column-Parallel Incremental ΔΣ ADCs Employing Bulk-DACs in 22-nm FDSOI Technology, X.Huang et al.
Wednesday 23 February 2022
Session 16
Flex6502: A Flexible 8b Microprocessor in 0.8μm Metal-Oxide Thin-Film Transistor Technology Implemented with a Complete Digital Design Flow Running Complex Assembly Code, H. Celiker et al.
Thursday 24 February 2022
Session 24
A 1.66Gb/s and 5.8pJ/b Transcutaneous IR-UWB Telemetry System with Hybrid Impulse Modulation for Intracortical Brain-Computer Interfaces, M. Song et al.
Friday 25 February 2022
Forum 3 - The Path to 6G: Architectures, Circuits, Technologies for Sub-THz Communications, Sensing, and Imaging
Emerging Device and Heterogenous Integration Technologies for sub-THz Applications - Nadine Collaert
Saturday 26 February 2022
Forum 4 - Paving the Way to 200Gb/s Transceivers Silicon Photonics Technology for Next-Generation Transceivers - Joris Van Campenhout