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/IRPS 2026

IRPS 2026

March 22 - 26, 2026 | Tucson AZ, USA

Flagship conference for semiconductor device reliability.

Imec

  • 'A Review of Reliability in GaN Power HEMTs' by Matteo Borga, R&D Engineer, imec on March 22 at 8:30. 
  • 'Dynamic ON-State Breakdown of GaN-on-Si HEMT' by Hao Yu, Principal Member of Technical Staff, imec on March 25 at 16:40. 
  • 'A Multi-Die Self-Consistent Framework for Thermal Stability Analysis in Nanosheet 3D SiPs' by Yukai Chen, Researcher, imec on March 25. 
  • 'Wafer to Wafer Hybrid Bonding Pitch Scaling Challenges' by Stefaan Van Huylenbroeck, PMTS 3D Integration, imec on March 24 at 16:30.
  • 'Challenges in gate stack integration, defectivity, and reliability of 2D material FETs' by Quentin Smets, PMTS, imec on March 23 at 13:00.
  • 'Lifetime Model for p-Contact Induced Failures in Monolithic GaAs-on-Si Nano-Ridge Lasers Considering Junction Heating' session: 10A - Product Reliability/System Electronics Reliability, by Ping-Yi Hsieh, Researcher, on March 26, from 10:50-11:25, at the Grand Ballroom Salon BC.

Event details

IEEE International Reliability Physics Symposium (IRPS) is the premiere conference for engineers and scientists to present new and original work in the area of microelectronics reliability. Drawing participants from the United States, Europe, Asia, and all other parts of the world, IRPS seeks to understand the reliability of semiconductor devices, integrated circuits, and microelectronic assemblies through an improved understanding of both the physics of failure as well as the application environment. IRPS provides numerous opportunities for attendees to increase their knowledge and understanding of all aspects of microelectronics reliability. It is also an outstanding chance to meet and network with reliability colleagues from around the world.

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