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ISIG Executive Summit Taiwan 2026
May 12 - 13, 2026 | Taipei, Taiwan
Accelerating the Future: AI-Driven Innovations in Si-Photonics, Advanced Packaging, and Next-Generation Interconnect
Imec
Philippe Absil, Vice President IC-Link | imec silicon solutions, will deliver a presentation.
Event details
ISIG Taiwan 2026 is themed on Accelerating the Future: AI-Driven Innovations in Si-Photonics, Advanced Packaging, and Next-Generation Interconnect. Key topics include the following:
- Silicon Photonics and Co-Packaged Optics: Enabling High-Bandwidth Chiplet Interconnects
- Advanced Packaging Innovations for the Next Generation of AI Hardware
- Memory Scaling and High Bandwidth Memory (HBM): Powering AI Architectures
- Energy-Efficient Power Solutions for the Data Center of Tomorrow
- Global Semiconductor Market Outlook: Opportunities and Strategic Directions in the AI Era