PIC/CS/PE International Conference 2026
April 20 - 22, 2026 | Brussels, Belgium
Connecting the photonic integrated circuits, compound semiconductor & power electronics community
Imec
- PIC International
Imec is present with a booth on our Silicon photonics offering.
New Materials for Enabling High-performance Photonic Devices and Emerging Applications
by Leili Shiramin, Portfolio Manager, on April 21st
To meet AI-driven performance requirements, or to enable emerging application domains, it is necessary to integrate silicon photonics and silicon nitride photonics platforms with new materials. We will discuss these materials—including lithium niobate, III–V, GeSi, BTO, and polymers—alongside the devices they enable and their associated challenges, particularly in the context of gain elements such as lasers and semiconductor optical amplifiers (SOAs), as well as modulators.
Title TBC
by Yoojin Ban, Technology Diretor, on April 21st
- CS International
Advancing GaN Power Technologies: scaling to 300mm for the AI Era
by Pierre Gassot, Business Line Director, on April 21st
Over the past decade, imec has been supporting the power semiconductor industry with the enablement of GaN technologies offering a comprehensive industrial affiliation program to mutualize R&D efforts and licensing the intellectual property generated within and outside its partner consortium. These efforts spent on 200mm from the start resulted in the availability of 200V/650V and 40V/100V p-GaN HEMT technology platforms soon complemented with their monolithic integration derivatives based on Resistor Transistor Logic and built on Silicon or SOI with Deep Trench Isolation allowing GaN Power Integrated Circuits to be designed.
The ongoing Artificial Intelligence revolution is reshaping data centers and compute system architectures. New power semiconductor technologies are needed to manage the increased power fueling this new era.
In this context, imec is expanding its portfolio of GaN power technologies towards lower and higher voltage ratings to address the overall power conversion chain as well as moving to 300mm to aggressively scale device dimensions and to benefit from the most advanced processing tool capabilities.
- PE International
Title TBC
by Wenzhe Guo, Senior R&D Engineer, Computer System Architecture Department, on April 22nd
Events details
PIC, CS & PE International are part of AngelTech, which delivers a portfolio of insightful, informative, highly valued chip-level conferences. Bringing together multiple conferences, 800+ delegates, 80+ exhibitors, 120+ presentations and numerous networking opportunities, AngelTech is the number one global event covering compound semiconductor, photonic integrated circuits, advanced packaging and power electonics technologies. With a strong over-lap between the conferences, attendees and exhibitors are exposed to the full relevant supply chains and customer and supplier bases.
Discover more - PIC International