RADECS 2026

IC-Link and imec will be participating in RADECS, the annual international scientific and industrial forum on radiation and its effects on electronics and photonic materials, devices, circuits, sensors and systems. IC-Link is imec's division for custom chip manufacturing, covering ASICs, PICs, custom wafer processing and advanced packaging. Join us to learn more on imec’s latest R&D breakthroughs and the manufacturing options through IC-Link:

BOOTH #20

• ASICs services
• DARE libraries

POSTERS

• “Thick Oxide-Related Total-Ionizing Dose Effects in 7-nm FinFET technology”
  M. Gorbunov, A. Caglar, M. Van de Burgwal, L. Berti
  Session D: Radiation Effects in Devices & ICs
  September 30, 3:30 - 6:15 p.m.
  Maxim Gorbunov, R&D Engineer
   
• “Multi-Cell Upsets in a 7-nm Commercial FinFET Technology”
  M. Gorbunov, M. Van de Burgwal, L. Berti, T. Vervecken, D. Van Nuffel, T. Schulte, J. Vanden Berk, D. Geys
  Session B: Single Event Effects: Devices & ICs
  September 30, 3:30 - 6:15 p.m.
  Maxim Gorbunov, R&D Engineer

PRESENTATION

• "Total Ionizing Dose Response of a Dynamic Comparator in 22-nm FD-SOI”
  J. Zhao, Z. Li, Q. Ma, M. Gorbunov, Y. Qing, J. Prinzie, P. Leroux
  Session D: Radiation Effects in Devices & ICs
  September 29, 4:30 - 5:55 p.m.
  J. Zhao, KU Leuven