June 25 - 27, 2025 | Dresden, Germany
This Summit is a platform for gathering and exchange of knowledge and fostering of collaborations within the semiconductor sector.
Join imec's Kurt Herremans, Program Director, Automotive as he shares insights into imec’s Automotive Chiplet Program on Thursday, June 26 2:20pm-2:40pm.
Themed “Heterogeneous Integration: Bolstering Europe's Resilience,” the 3D & Systems Summit 2025 will spotlight strategies to strengthen Europe’s semiconductor industry. The program will tackle critical topics including geopolitical shifts, evolving market dynamics, and cutting-edge innovations in chiplet applications and hybrid bonding. The event will also feature an exclusive exhibition space highlighting both industry frontrunners and pioneering startups. Designed as a dynamic forum, the Summit aims to spark dialogue, share knowledge, and cultivate collaboration across the semiconductor ecosystem.