31 January - 03 February 2024 | COEX, Seoul
Talks by imec:
Stefan Decoster will give a talk on Direct metal etch for nano-interconnect applications at 20 nm pitch and below at STS S4. Plasma and Etching Technology
Nancy Heylen will give a talk on CMP challenges in advanced interconnect and 3D packaging at STS S5. CMP & Cleaning Technolgy
Alain Phommahaxay will give a talk on Advanced packaging at STS S6. Electropackage System and Interconnect Product
Cong Chen will take up the speaking slot in the session on Inspection for wafer bonding in the Metrology and Inspection Forum.
Hyo Seon Suh will present in the session on Advanced Lithograpy
This exhibition will showcase the latest semiconductor materials, equipment, and related technologies. With special features including semiconductor technology symposium, market trend forum, supplier search programs and networking events to exchange the latest information. This will be a real and strategic opportunity to examine the present and future of the global semiconductor industry.