/Semicon Korea 2024

Semicon Korea 2024

31 January - 03 February 2024 | COEX, Seoul


Talks by imec:

January 31st

  • Pierre Morrin will give a talk on New Channel Materials at STS S2. Advanced Materials and Process Technology

February 1st

  • Stefan Decoster will give a talk on Direct metal etch for nano-interconnect applications at 20 nm pitch and below at STS S4. Plasma and Etching Technology

  • Nancy Heylen will give a talk on CMP challenges in advanced interconnect and 3D packaging at STS S5. CMP & Cleaning Technolgy

  • Alain Phommahaxay will give a talk on Advanced packaging at STS S6. Electropackage System and Interconnect Product

  • Cong Chen will take up the speaking slot in the session on Inspection for wafer bonding in the Metrology and Inspection Forum.

  • Hyo Seon Suh will present in the session on Advanced Lithograpy

Event details

This exhibition will showcase the latest semiconductor materials, equipment, and related technologies. With special features including semiconductor technology symposium, market trend forum, supplier search programs and networking events to exchange the latest information. This will be a real and strategic opportunity to examine the present and future of the global semiconductor industry.

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