CMOS: advanced and beyond
Discover why imec is the premier R&D center for advanced logic & memory devices.
Integrated photonics
Take a look at technologies for optical transceivers, sensors and more.
Health technologies
See how imec brings the power of chip technology to the world of healthcare.
Sensing and actuation
Explore imec’s CMOS- and photonics-based sensing and actuation systems.
Connectivity technology
Look into our reliable, high-performance, low-power network technologies.
More expertises
Discover all our expertises.
Research
Be the first to reap the benefits of imec’s research by joining one of our programs or starting an exclusive bilateral collaboration.
Manufacturing
Go from idea to scalable and reliable semiconductor manufacturing with IC-Link.
Venturing
We create and co-create new ventures, and we invest in and accelerate existing ventures.
Education and workforce development
Imec supports formal and on-the-job training for a range of careers in semiconductors.
NanoIC pilot line
Aligned with the EU Chips Act, access to the pilot line will accelerate beyond-2nm innovation.
SEMICON Taiwan 2026
September 02 - 04, 2026 | Taipei, Taiwan
Transform tomorrow
IC-Link and imec will be participating in Semicon Taiwan, a leading platform that connects Taiwan’s microelectronics ecosystem with the global semiconductor community and fosters collaboration between industry, government, academia, and research institutions. IC-Link is imec's division for custom chip manufacturing, covering ASICs, PICs, custom wafer processing and advanced packaging.
Join us to learn more on imec’s latest R&D breakthroughs and the manufacturing options through IC-Link:
PRESENTATIONS
- The Photonic Fabric, a heterogeneous integration challenge
Optical networking is today at the heart of the AI infrastructure scaling, from the rack-to-rack to the campus-wide interconnectivity. In the near future, photonics links will displace copper for the short distance data exchange within the racks and even within the server blades. To realize this, the photonic-enabled fabric must demonstrate superior performance while keeping power consumption under control. In this presentation, we will review how heterogeneous integration addresses this challenge.
Session: "Silicon Photonics Global Summit"
August 31
Philippe Absil, Vice President IC-Link | imec silicon solutions - IC Forum – Advanced Chip Technology and Manufacturing
August 31
Philippe Leray, Vice President R&D Advanced Patterning Development - MEMS & Sensors Forum
August 31
Stefano Guerriri, Portfolio Director - Low-Voltage RF GaN technology for Handset Power Amplifiers
The growing demand for high-speed mobile connectivity calls for efficient, high-performing, and cost-efficient components. Therefore, GaN-on-Si technology offers a very promising solution for high-power amplifiers operating in the FR3 frequency band.
We report on the continuous R&D efforts pushing the boundaries of GaN-on-Si technology towards adoption in low voltage handset applications. We demonstrate a power density of 1 W/mm at 13 GHz from a 5 V supply while achieving 66% power-added efficiency. We further present innovative performance-enhancement techniques and discuss the remaining reliability and manufacturing challenges on the path to commercialization.
Session: "Power and Compound Semiconductor Forum"
September 1
Bertrand Parvais, Scientific Director - Semiconductor Advanced Inspection and Metrology Forum
September 4
Philippe Leray, Vice President R&D Advanced Patterning Development