06 - 08 September 2023 | Taipei, Taiwan
Inspire innovation. Empower sustainability.
MEMS & Sensors Forum
8:30 am - 4:50 pm: Accelerating ADAS: deep-tech innovations behind next-gen driver assistance - Marcus Dahlem
Heterogeneous Integration Global Summit
2:35 pm - 3:05 pm: Thermal challenges and advanced cooling opportunities for 2.5D and 3D HPC - Dr. Herman Oprins
Power and Opto Semiconductor Forum | NExT Forum
8:30 am - 4:55 pm: III-V/N-on-Si: a low-cost, high-performance solution for RF front-ends - Bertrand Parvais
10:00 am - 12:00 pm: Women in Semiconductor Panel - Mavis Ho
Heterogeneous Integration International Summit Forum
2:00 pm - 2:20 pm: 2.5D “Chiplet” and 3D-SOC integration: Heterogeneous Technology - Eric Beyne